Integrated type high-thermal-conductivity circuit board and manufacturing method thereof
A production method and high thermal conductivity technology, applied in the directions of printed circuit manufacturing, circuit substrate materials, circuits, etc., can solve the problems of reducing the heat dissipation performance of the LED substrate, low thermal conductivity of epoxy resin, and low heat dissipation coefficient of the LED substrate.
Inactive Publication Date: 2013-09-25
SHANGHAI JIUJUN ELECTRONICS SCI & TECH
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Problems solved by technology
[0002] The traditional LED substrate usually includes aluminum plate, epoxy resin and circuit layer. The thermal conductivity of epoxy resin is low, which leads to the low heat dissipation coefficient of the LED substrate as a whole.
The traditional LED substrate needs to be pasted together with the heat sink during use, and the LED substrate and the heat sink need to be pasted together with adhesive materials, resulting in the incomplete contact between the LED substrate and the heat sink, which further reduces the heat dissipation performance of the LED substrate
Method used
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[0015] Such as Figure 1-2 As shown, the present invention provides an integrated high thermal conductivity circuit board, including a metal substrate 1 and a circuit layer 3, the metal substrate 1 and the circuit layer 3 are combined through the ceramic layer 2, and the ceramic powder is directly sprayed on the metal substrate by subsonic spraying A ceramic layer 2 is prepared on the surface of the ceramic layer 2, and a circuit layer 3 is prepared by directly spraying a material with high thermal conductivity and low resistance on the surface of the ceramic layer 2 by thermal spraying technology.
[0016] The metal substrate 1 can be made of alloy powder of any metal or non-metal material with high thermal conductivity and low resistance, such as iron, aluminum, ceramics, graphite and the like. The metal substrate 1 needs to undergo pre-treatment, and the pre-treatment includes surface roughening, ultrasonic cleaning and drying. The optional surface roughening process is di...
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Abstract
The invention discloses an integrated type high-thermal-conductivity circuit board and a manufacturing method thereof. The integrated type high-thermal-conductivity circuit board comprises a metal base plate and a circuit layer, wherein the circuit layer is combined with the metal base plate through a ceramic layer, ceramic powder is sprayed onto the surface of the metal base plate to form the ceramic layer, high-thermal-conductivity and low-impedance materials are sprayed onto the surface of the ceramic layer to form the circuit layer, or a circuit imprint is pressed on the surface of the ceramic layer by a punch press and then the circuit layer is sprayed into the imprint. According to the integrated type high-thermal-conductivity circuit board, the heat-conducting property is good, and cohesiveness between the metal base plate and the circuit layer is good.
Description
technical field [0001] The invention belongs to the field of LEDs, and more specifically relates to an LED substrate. Background technique [0002] The traditional LED substrate usually includes an aluminum plate, epoxy resin and circuit layer. The thermal conductivity of the epoxy resin is low, resulting in a low heat dissipation coefficient of the LED substrate as a whole. Traditional LED substrates need to be pasted together with radiators during use, and LED substrates and radiators need to be pasted together with adhesive materials, resulting in incomplete contact between LED substrates and radiators, which further reduces the heat dissipation performance of LED substrates. Contents of the invention [0003] The invention provides an integrated circuit board with high thermal conductivity. [0004] According to one aspect of the present invention, an integrated circuit board with high thermal conductivity is provided, which includes a metal substrate and a circuit la...
Claims
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IPC IPC(8): H05K1/05H05K3/00H01L33/62H01L33/64
Inventor 傅华贵黄国平
Owner SHANGHAI JIUJUN ELECTRONICS SCI & TECH