Short-term high-temperature resistant acrylic-based composition and method for preparing heat conducting fin by using same

An acrylic-based, short-term high-temperature technology, applied in the direction of polymer adhesive additives, film/sheet adhesives, non-polymer adhesive additives, etc., can solve the problem of no obvious change in surface viscosity and thermal conductivity, There is no mention of the softness and hardness of the acrylic heat conduction sheet, and the effect of good softness and hardness is achieved

Inactive Publication Date: 2013-10-09
SUZHOU TIANMAI THERMAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the existing published technology, there is no mention of how the acrylic thermal conductive sheet can meet the requ

Method used

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  • Short-term high-temperature resistant acrylic-based composition and method for preparing heat conducting fin by using same

Examples

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Example Embodiment

[0040] Prepolymer preparation: add a certain amount of 2-hydroxy-2-methyl-1-phenyl-1-acetone to 100 parts of 2-ethylhexyl acrylate monomer or 2-ethylhexyl methacrylate , A certain portion of phenyl bis(2,4,6-trimethylbenzoyl) phosphine oxide, under a 16-20W ultraviolet curing lamp, stir and irradiate, remove the ultraviolet curing lamp after 3-10 minutes A prepolymer with a viscosity of 3000-5500cps is obtained. Or add a certain amount of lauroyl peroxide to 100 parts of 2-ethylhexyl acrylate monomer or 2-ethylhexyl methacrylate, stir in an oil bath at 100°C for 5-15 minutes, and remove the oil bath. A prepolymer with a viscosity of 2000-5000cps can be obtained.

[0041] Preparation of adhesive: add 0.05 to 1 part of monomer with two or more acrylic functional groups to 100 parts of the prepared prepolymer, and then add 0.2 to 0.5 part of free radical initiator. Stir at a temperature of ℃ and dissolve it.

[0042] Fill 8 to 33 parts of adhesive and 1 to 3 parts of heat-resistant...

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Abstract

The invention discloses a short-term high-temperature resistant acrylic-based composition and a method for preparing a heat conducting fin by using the same. The short-term high-temperature resistant acrylic-based composition comprises a binding agent, a heatproof additive and a heat conducting powder, wherein the binding agent part is prepared from a prepolymer, a monomer crosslinking agent and a radical initiator, wherein the prepolymer is prepolymerized from an acrylic-based monomer with a single function group and a prepolymerization radical initiator, and the glass transition temperature of the acrylic-based monomer is lower than 50 DEG C below zero; the monomer crosslinking agent has two or more acrylic-based function groups; the heatproof additive is an oligomer or copolymer with a maleinimide chain segment; and the heat conducting powder is a known heat conducting powder. The invention also discloses a method for preparing a heat conducting fin by using the acrylic-based composition; and the heat conducting fin prepared by using the method still can keep the favorable hardness, surface viscosity and heat conducting property after being thermally aged for 10min at the temperature of 250 DEG C, even 260 DEG C, so that the requirement of an electronic product can be met better.

Description

technical field [0001] The invention relates to a short-time high-temperature-resistant acrylic-based composition and a method for preparing a heat-conducting sheet, in particular to an acrylic-based heat-conducting sheet used in electronic products and a formula composition thereof. Background technique [0002] While electronic products are developing from heavy and thick to light and thin, their core components are also developing towards stronger performance and more integrated functions. This also brings about the problem of heat. If the excess heat in an electronic product cannot be conducted effectively in a timely manner, it will not only reduce its service life, but also have a negative impact on customer experience. It is no longer realistic to use fans for heat dissipation in a limited space. A material that can fill the gap and transfer heat becomes a good choice. [0003] At present, thermally conductive silicone sheets, acrylic-based thermally conductive she...

Claims

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Application Information

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IPC IPC(8): C09J133/08C09J133/10C09J11/08C09J11/04C09J7/00
Inventor 刘晓阳
Owner SUZHOU TIANMAI THERMAL TECH
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