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Flexible resistance-type MEMS (micro-electro-mechanical systems) temperature sensor array and preparation method thereof

A temperature sensor and resistive technology, which is applied in the field of medical engineering, can solve the problems of thermal deformation of the base material, failure to work normally, sensor damage, etc., and achieve high ultrasonic propagation speed, low processing cost, and wide application prospects

Active Publication Date: 2013-11-13
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of flexible base material is more suitable when the working temperature is low (less than 100°C). When the instantaneous temperature shock is higher than 100°C, the base material will be thermally deformed or even damaged, resulting in sensor damage. Can not work normally

Method used

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  • Flexible resistance-type MEMS (micro-electro-mechanical systems) temperature sensor array and preparation method thereof
  • Flexible resistance-type MEMS (micro-electro-mechanical systems) temperature sensor array and preparation method thereof
  • Flexible resistance-type MEMS (micro-electro-mechanical systems) temperature sensor array and preparation method thereof

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Experimental program
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Embodiment 1

[0040] Such as figure 1 As shown, the present embodiment provides a flexible resistive MEMS temperature sensor array, including a fixed base 1, a flexible base film 2, an array of temperature-sensitive films 3, an electrode array 4, a flexible covering film 5 and electrical leads 6, wherein: flexible The base film 2 is fixed on the fixed base 1, the array of temperature sensitive films 3 is deposited on the flexible base film 2, the electrode array 4 is patterned on the flexible base film 2, and the flexible cover layer film 5 is patterned and covered on the array of temperature sensitive films 3, Electrical leads 6 connect the electrode array 4 .

[0041] In this embodiment, the fixed base 1 is a silicon wafer.

[0042] In this embodiment, the flexible base film 2 is made of PI material with a thickness of 50 μm.

[0043] In this embodiment, the temperature-sensitive thin film 3 is Cr / Pt with a thickness of 200 nm.

[0044] In this embodiment, the electrode array 4 is a Ti...

Embodiment 2

[0062] Such as image 3 As shown, the present embodiment provides a flexible resistive MEMS temperature sensor array, including a fixed base 1, a flexible base film 2, an array of temperature-sensitive films 3, an electrode array 4, a flexible covering film 5 and electrical leads 6, wherein: flexible The base film 2 is fixed on the fixed base 1, the temperature sensitive film 3 is deposited on the flexible base film 2, the electrode array 4 is patterned on the flexible base film 2, the flexible cover layer film 5 is patterned and covered on the temperature sensitive film 3, and the electric wire 6 is connected to the electrode array 4 .

[0063] In this embodiment, the fixed base 1 is glass with a thickness of 500 μm.

[0064] In this embodiment, the flexible base film 2 is made of PI material with a thickness of 10 μm.

[0065] In this embodiment, the temperature-sensitive thin film 3 is Ti / Au with a thickness of 20nm / 200nm.

[0066] In this embodiment, the electrode array...

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Abstract

The invention provides a flexible resistance-type MEMS (micro-electro-mechanical systems) temperature sensor array and a preparation method thereof. The sensor array comprises a fixed substrate, a flexible substrate film, a temperature sensitive film, sensor electrodes, a flexible covering layer and electrical conductors. A preparation method for the sensor array comprises the following steps of forming a metal sacrificial layer on the upper surface of a fixed substrate material in a sputtering or thermal evaporation manner, performing spin coating on the sacrificial layer with PI (polyimide), preparing the temperature sensitive film, preparing sensor electrode arrays, preparing the covering layer PI film, imaging the covering layer PI film, peeling off flexible sensors and welding the electrical conductors. The sensor array provided by the invention has biocompatibility, stronger mechanical property, high-temperature resistance, high temperature impact resistance and higher ultrasonic propagation speed. Sizes and shapes of the sensitive film and sensor electrode points can be controlled by exposure, and the temperature field distribution of a skin surface can be measured in real time. The preparation method for the sensor array is simple and reliable and low in cost, and can be realized by adopting a micromachining process.

Description

technical field [0001] The invention relates to a temperature sensor array in the field of medical engineering, in particular to a flexible resistive MEMS temperature sensor array and a preparation method thereof. Background technique [0002] Over the past few decades, high-energy focused ultrasound (HIFU) has been extensively studied for thermal ablation of tumor cells. Volume ultrasound is more effective in expanding the tumor resection area per ultrasound, but the resulting temperature rise of the skin and fat layer limits the efficiency of tumor cell resection. In order to avoid thermal damage to the skin and fat layer during ultrasonic resection of tumor cells, it is necessary to obtain the temperature field distribution on the surface of the skin layer. The flexible temperature sensor array can be bent to the same curvature as the skin, directly attached to the skin surface, and measures the temperature field distribution of the skin surface, which is an effective wa...

Claims

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Application Information

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IPC IPC(8): A61B5/01
Inventor 刘景全江水东杨春生
Owner SHANGHAI JIAO TONG UNIV
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