An integral LED packaging structure and packaging method
An LED packaging and integrated technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as damage, unfavorable rapid promotion of LEDs, and reduced product stability, achieving flexible application, beneficial product life, and good light shape. Effect
Active Publication Date: 2015-10-28
陕西电子信息集团光电科技有限公司
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Problems solved by technology
Due to the special performance requirements of LEDs, on the one hand, it is necessary to do a good job of heat dissipation in the application, and on the other hand, it is necessary to make a secondary light distribution for different lighting scenarios, so the above-mentioned packaging forms are very complicated in application. At the same time, in welding, heat dissipation, light distribution and other links, it is easy to cause secondary or even tertiary damage to the light source due to control problems, which greatly reduces the stability of the product and is not conducive to the rapid promotion of LED
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preparation example Construction
[0045] Step 1, preparation of integral support frame unit:
[0046] 1) Using the injection molding process, put the injection molded body of the support frame with 9 holes reserved for plug-in electrodes and heat capacitor bosses into the injection mold, and inject it into an integral support frame injection molded body with fixed connectors;
[0047] 2) Install plug-in electrodes on the injection molding body of the integral support frame. The plug-in electrodes are made of copper foil or aluminum foil, and are stamped to form the expected electrode structure. The boss 9 of the heat capacitor is inlaid; the boss 9 of the heat capacitor is made by metal die-casting or fired by ceramics;
[0048] Step 2. Encapsulate on the surface of the support frame:
[0049] 1) Fixedly arrange the array of chips 14 on the inner side of the support frame 16, carry out crystal bonding and wire bonding in the support frame, conduct the chip 14 and the electrode through the bonding wire, cover ...
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The invention discloses an integral type LED (Light Emitting Diode) encapsulation structure and method. The integral type LED encapsulation structure comprises a supporting frame, chips and a lens; the chips are placed on the inner side of the supporting frame; the lens is arranged on the surface of the supporting frame; the supporting frame is snapped with the lens through connecting fasteners; a hot melting boss is embedded along the inner side of the supporting frame under the chips; the supporting frame which is arranged on the outer side of the hot melting boss is provided with an insertion joint electrode; fixed plug connectors are vertically distributed on the supporting frame which is arranged on the outer side of the insertion joint electrode. The integral type LED encapsulation method comprises producing an integral type supporting frame unit; performing encapsulation on the surface of the supporting frame; connecting the lens through the ring-shaped fasteners. According to the integral type LED encapsulation structure and method, a new heat-dissipating method is selected and used to disperse heat in the area of a light source and conduct out the heat through a heat-dissipating element, so that the LED application can be flexible; manual replacement without tools is achieved, so that the difficulty of the replacement is decreased and the popularization of products can be improved; an independent fixed optical structure is arranged, so that the stability of product performance application is greatly improved; the integral type encapsulation can reduce light source processing.
Description
technical field [0001] The invention belongs to the technical field of semiconductor device packaging, and relates to a power LED packaging structure and packaging method. Background technique [0002] LED packaging is to process light-emitting diodes into devices so that they have specific light-emitting characteristics, and then use them in lighting, backlighting and other fields. The power type LED package has high single power and high brightness, and is mainly used in the field of lighting and lighting, indoor and outdoor lighting, night scene lighting, vehicle lighting and other places. [0003] The current LED packaging, in terms of packaging form, mainly includes leaded packaging, surface mount packaging, high-power packaging and COB packaging. Pin-type packaging mainly belongs to the early packaging technology. Its main products are low-power products, with a single chip within 0.1w and a small volume. For example, the circle is divided into Φ2mm, Φ3mm, Φ4.4mm, Φ5m...
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IPC IPC(8): H01L33/48H01L33/64H01L33/58
Inventor 李涛田仿民于浩童华南
Owner 陕西电子信息集团光电科技有限公司