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Arrangement device for CCGA (ceramic column grid array) packaging welding columns and pins

A technology for arranging devices and welding pins, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of being unsuitable for multi-variety, multi-batch production, low production efficiency, long production cycle, etc., and achieves simple structure, location Good precision, suitable for mass production

Active Publication Date: 2015-05-20
58TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the arrangement of welding columns / welding needles is arranged by a fully automatic needle loading machine or manually discharged one by one. The automatic needle loading machine requires a set of molds to be customized for each array specification. The cost is high and the production cycle is long. It is not suitable for multiple varieties, Multi-batch production; manual assembly is extremely low in production efficiency for hundreds of welding posts / pins, and is also not suitable for production

Method used

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  • Arrangement device for CCGA (ceramic column grid array) packaging welding columns and pins
  • Arrangement device for CCGA (ceramic column grid array) packaging welding columns and pins
  • Arrangement device for CCGA (ceramic column grid array) packaging welding columns and pins

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Example 1: 1.27mm pitch CCGA560 and CCGA575 welding columns are arranged as follows Figure 5 shown.

[0024] The 1.27mm pitch CCGA560 and CCGA575 welding post arrangement devices have a pitch of 1.27mm, Φ0.60mm, and the number of arrays is 50×50.

[0025] See Figure 5 a, the package soldering post arrangement after arrangement and soldering see Figure 5 b;

[0026] When the 1.27mm pitch CCGA575 welding columns are arranged, replace the stopper (24×24 array), see Figure 5 c. See Figure 5 d.

Embodiment 2

[0027] Example 2: 1.00mm pitch CCGA1144 and CCGA1760 welding columns are arranged as Image 6 shown.

[0028] The 1.00mm pitch CCGA1144 and CCGA1760 welding post arrangement devices have preset positioning block 2 through-hole pitches of 1.00mm and Φ0.50mm, and the number of arrays is 50×50.

[0029] 1.00mm pitch CCGA1144 welding column arrangement block see Image 6 a, 34×34 array, after arrangement and soldering see Image 6 b;

[0030] When the 1.00mm pitch CCGA1760 welding columns are arranged, replace the block, see Image 6 c, 42×42 array, after arrangement and soldering see Image 6 d.

[0031] It can be seen that the welding column / welding needle arrangement device provided by the present invention has the following characteristics:

[0032] (1) The present invention utilizes vacuum suction traction, wide-mouth guide and 12-hole guide, and the welding column falls under gravity when tilted, and the welding column / welding needle arrangement and alignment are compl...

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Abstract

The invention relates to an arrangement device for CCGA (ceramic column grid array) packaging welding columns and pins. The device comprises a body, a preset positioning block and a retainer plate. The body comprises an upper cavity and a lower cavity. The upper cavity is communicated with the lower cavity through vertical holes. A moving partition is mounted on the lower portion of the body and hermetically covers the lower cavity. The side of the body is provided with a suction hole communicated with the lower cavity of the body. The preset positioning block includes a vertical hole array. The retainer plate includes a round through hole array. The diameter of the round holes matches with that of the vertical through holes. The preset positioning block is located in the central vertical hole of the body. The retainer plate is located below the preset positioning block. The arrangement device has the advantages that the arrangement problem of welding cylinders / pins is solved through use of the device, the efficiency of arranging CCGA packaging welding cylinders and pins is greatly improved, welding quality is greatly improved and the cost is greatly saved.

Description

technical field [0001] The invention relates to a device for arranging CCGA packaging welding columns / welding needles according to a predetermined pitch and array, and belongs to the technical field of integrated circuit manufacturing. Background technique [0002] The semiconductor integrated circuit device is brazed / soldered on the CLGA (Ceramic Land Grid Array Package) shell or substrate to make a CCGA (Ceramic Column Grid Array) device, such as figure 1 shown. Soldering posts / soldering pins must be arranged in an orderly manner before welding and be perpendicular to the shell with solder paste or the pad of the substrate, and the position and flatness accuracy meet the installation requirements. [0003] At present, the arrangement of welding columns / welding needles is arranged by a fully automatic needle loading machine or manually one by one. The automatic needle loading machine requires that a set of molds must be customized for each array specification. The cost...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/12
Inventor 丁荣峥杨轶博陈波
Owner 58TH RES INST OF CETC
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