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GaN Schottky diode based on modulation doping

A Schottky diode, modulation doping technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problem of no modulation Schottky diode, etc., to improve electron concentration distribution, increase electron mobility, and improve work The effect of frequency

Active Publication Date: 2013-11-20
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is no work on modulating Schottky diodes doped with GaN materials at home and abroad.

Method used

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  • GaN Schottky diode based on modulation doping

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Embodiment 2

[0027] The difference from Embodiment 1 is that the N-type GaN layer 103 is grown nonlinearly from the interface of the N+-type GaN layer 102 using a gradient doping method, and the change mode of the doping concentration obeys a Gaussian distribution or an exponential distribution and can also be Other nonlinear distributions, such as t distribution, Γ distribution, etc.

[0028] In this embodiment, the substrate layer 101 is SiC, and may also be other semiconductor materials such as Si.

[0029] The present invention grows an N-type GaN layer on an N+-type GaN layer by means of modulated doping, which improves the electron concentration distribution in the material, improves the mobility of the GaN material, reduces the Schottky junction capacitance of the diode, and improves its The operating frequency, thereby improving the operating frequency and output power of the frequency multiplier circuit in the millimeter wave and terahertz range; by controlling the modulation dopi...

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Abstract

The invention discloses a GaN Schottky diode based on modulation doping, belonging to the field of a semiconductor device. The GaN Schottky diode comprises a semi-insulated substrate layer, a high-doped N+ type GaN layer and an N- type GaN layer, wherein the substrate layer is used for supporting the whole GaN Schottky diode; the N+ type GaN layer is grown on the substrate layer; and the N- type GaN layer adopts the modulation doping to grow on the N+ type GaN layer. The doping concentrations of the N- type GaN layer are non-uniformly distributed from the interface of the N+type GaN layer, an Ohmic contact electrode is grown on the N+ type GaN layer, and a Schottky contact electrode is grown on the N- type GaN layer. The N- type GaN layer is grown on the N+ type GaN layer in the modulation doping mode, the migration rate of a GaN material is increased, the electronic concentration distribution in the material is improved, the Schottky junction capacitance of the diode is reduced, the working frequency of the diode is increased, and therefore the working frequency and the output power of a frequency doubling circuit in a millimeter wave and terahertz range are increased. The variable capacitance rate of the Schottky diode can be effectively controlled by controlling the modulation doping, and the Q value of a device is increased.

Description

technical field [0001] The invention belongs to the field of semiconductor devices. Background technique [0002] Schottky frequency doubler diode devices based on traditional semiconductor materials such as Si and GaAs are limited by the properties of the material itself, so it is difficult to further improve the corresponding indicators such as power and breakdown voltage. In recent years, a new generation of wide-bandgap semiconductor materials represented by group III nitrides has developed rapidly. It has excellent material properties such as wide band gap, high saturated electron drift velocity, high breakdown field strength and high thermal conductivity, and has great development potential in the field of millimeter wave and submillimeter wave high-power electronic devices. Research on GaN-based Schottky varactor millimeter-wave and submillimeter-wave frequency doubling devices is currently a hot spot in the world, and domestic research is still at a very low frequen...

Claims

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Application Information

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IPC IPC(8): H01L29/872H01L29/06H01L29/45H01L29/47
Inventor 梁士雄冯志红房玉龙邢东王俊龙张立森杨大宝
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP