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Novel surface-mounted bridge-type rectifier and manufacturing method thereof

A bridge rectifier, surface mount technology, used in semiconductor/solid-state device manufacturing, semiconductor devices, electrical solid-state devices, etc., can solve the problems of reduced heat dissipation performance, many solder joints, and waste of space, saving space and improving heat dissipation. The effect of efficiency

Inactive Publication Date: 2013-11-20
朱艳玲
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, due to the poor stability of the rectifier chip on the bump, it is easy to cause the rotation and displacement of the rectifier chip and the bridge piece during high-temperature reflow, resulting in quality problems, and there are many soldering points inside the product. There are a total of 10 soldering points between the soldering point and the output terminal, which not only increases the conduction thermal resistance due to more soldering points, reduces the heat dissipation performance, but also causes a waste of space, so that the device cannot be made smaller

Method used

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  • Novel surface-mounted bridge-type rectifier and manufacturing method thereof
  • Novel surface-mounted bridge-type rectifier and manufacturing method thereof
  • Novel surface-mounted bridge-type rectifier and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0036] Embodiment 1: refer to figure 1 and figure 2 As shown, the new surface mount bridge rectifier includes four rectifier chips 31 forming a bridge rectifier circuit, input terminals 5 , output terminals 6 , plastic package 50 , upper lead frame unit 10 and lower lead frame unit 20 . Wherein, the outline of the rectifier chip 31 forms a regular rectangle or square, and it is connected with the upper and lower lead frame units 10 and 20 through the welding material 40 .

[0037] refer to Figure 3 to Figure 6 As shown, the upper lead frame unit 10 includes two metal sheets 9a, 9b, one welding plane 12 and one welding boss 11 are respectively arranged on the metal sheets 9a, 9b, and the negative poles of the two rectifier chips 31 are respectively connected to the two Solder plane 12 connections.

[0038] refer to Figure 7 to Figure 11 As shown, the lower lead frame unit 20 includes two metal sheets 9c and 9d, wherein a welding plane 23 is provided on the metal piece 9c...

Embodiment 2

[0040] Embodiment 2: The four rectifier chips 31 forming a bridge rectifier circuit are glass-passivated fast-recovery rectifier chips or Schottky rectifier chips.

Embodiment 3

[0041]Embodiment 3: a kind of method of manufacturing novel surface-mounted bridge rectifier is: a, be coated with welding material: respectively on each upper lead frame unit 10 and the welding plane 12,22,23 on the lower lead frame unit 20 and welding Dip the welding material 40 on the boss 11,21, b, place the rectifier chip: place the rectifier chip 31 on the welding plane 12,23 on each upper lead frame unit 10 and the lower lead frame unit 20 respectively and make the rectifier chip The positive pole of 31 faces upwards, c. Assembly: put the upper lead frame 1 formed by arraying a plurality of upper lead frame units 10 on a dedicated positioning jig, and place the upper lead frame 1 formed by arraying a plurality of lower lead frame units 20 After the lower lead frame 2 is overturned, it is placed on the upper lead frame 1 according to the set position, d. Welding: the positioning fixture carrying the upper lead frame 1 and the lower lead frame 2 is sent into the high-tempe...

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Abstract

The invention discloses a novel surface-mounted bridge-type rectifier and a manufacturing method thereof. The rectifier comprises four rectifying chips which constitute a bridge rectifier circuit, an input terminal, an output terminal, a plastic package body, a plurality of up lead framework units and a plurality of down lead framework units, wherein the up lead framework units and the down lead framework units are arranged in an array manner and constitute an up lead framework and a down lead framework respectively; the down lead framework units adopt bent rectifying chip welding plane structures; both the input terminal and the output terminal straightly extend out to the two sides from the bottom of the plastic package body without being bent, and the terminals are coplanar. The manufacturing method comprises the steps of applying welding material, placing the rectifying chips, assembling, welding, plastic packaging, trimming and electroplating. The novel surface-mounted bridge-type rectifier has the characteristics of more reasonable arrangement, better reliability, better heat dissipation performance, higher production efficiency and the like; under the condition of like products with the same overall sizes, a bridge-type rectifier with higher power can be packaged.

Description

technical field [0001] The invention relates to a novel semiconductor device, in particular to a novel surface mounted bridge rectifier and a manufacturing method thereof. Background technique [0002] Conversion from AC to DC for a small current is necessary in almost all equipment. This process is called rectification, and its purpose is to provide a stable DC power supply for the operation of the device. There are two ways to achieve rectification: one is to use discrete devices to form a rectification circuit on the PCB to realize rectification conversion. This method is complex and not conducive to miniaturization; The degree of miniaturization of this device depends on the spatial arrangement density of the chips during the device packaging process and the precise positioning of the rectifier chips in the device in the micro space. With the gradual improvement of miniaturization requirements for low-power equipment, on the one hand, the density of surface mount devic...

Claims

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Application Information

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IPC IPC(8): H02M7/00H01L25/07H01L23/495H01L21/50
CPCH01L2924/12032H01L2224/40137H01L2224/40095H01L2224/40139H01L2924/181H01L2224/4007H01L2224/371H01L2224/84801H01L2224/83801H01L2224/37H01L2224/40H01L2224/32245H01L24/84H01L24/40H01L2224/84345H01L2924/00H01L2924/00012H01L2924/00014
Inventor 朱艳玲
Owner 朱艳玲