Photocurable/thermosetting inkjet composition, and printed wiring board using same
A printed circuit board, thermosetting technology, applied in the direction of printed circuit, printed circuit manufacturing, printing, etc., can solve the problems of peeling off of marking pattern, decrease of adhesion between marking pattern and resin insulating layer, increase of viscosity of marking ink, etc., to achieve Improved heat resistance, excellent adhesion, and excellent chemical resistance
Active Publication Date: 2015-07-08
TAIYO HLDG CO LTD
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- Abstract
- Description
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- Application Information
AI Technical Summary
Problems solved by technology
[0006] In addition, in recent years, the demand for white marking ink used in the above-mentioned inkjet method has been increasing, but when titanium oxide, which is suitable as a white pigment, is compounded, the viscosity of the marking ink will increase
In addition, since the method of lowering the molecular weight of the resin composition is usually taken as a countermeasure, there are problems such as a decrease in the adhesion between the marking pattern and the resin insulating layer, and the marking pattern is peeled off from the resin insulating layer.
Therefore, there is no practical white marking ink that can be used by inkjet printers
Method used
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Experimental program
Comparison scheme
Effect test
Embodiment
[0054] Hereinafter, examples of the photocurable thermosetting composition for inkjet according to the first embodiment of the present invention are shown, and the present invention will be specifically described, but the present invention is not limited to these examples. In addition, unless otherwise specified below, "parts" means parts by mass.
[0055] For Examples 1 to 5 and Comparative Examples 1 to 6, the ingredients were mixed in the proportions shown in Table 1, stirred with a dissolver, and then filtered with a 1 μm disc filter to obtain each composition.
[0056] Table 1
[0057] Table 1
[0058]
Example 1
Example 2
Example 3
Example 4
Implement Iraq 5
Comparative example 1
Comparative example 2
Comparative example 3
Comparative example 4
Comparative example 5
Comparative example 6
GMA
40
30
50
40
40
4HBAGE
40
EA—1010N
40
AGE
40
4HBA
40
40
DPGDA
...
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Abstract
Provided is a photocurable / thermosetting inkjet composition characterized in comprising: a monomer having a (meth)acryloyl group and a glycidyl group in the molecule thereof, and having a viscosity of 10 mPa°s or less at 25°C; a trifunctional or higher acrylate monomer; a heat-curing catalyst; and a photopolymerization initiator. Also provided is a photocurable / thermosetting inkjet composition obtained by including titanium oxide in the composition described above, and characterized in being used to draw a pattern on a resin insulation layer formed on a printed wiring board.
Description
Technical field [0001] The present invention relates to a photocurable thermosetting composition and a printed circuit board having a resin insulating layer formed by using the photocurable thermosetting composition. The photocurable thermosetting composition is a photocurable heat for forming a resin insulating layer. It is a curable composition, and it is suitable to directly draw a pattern as an insulating layer and a mark on the substrate for a printed circuit board using an inkjet printer. Background technique [0002] As a method of manufacturing a printed circuit board using an inkjet printer, there is, for example, a method of forming a conductor circuit in which a resist layer is formed on a metal foil on a plastic substrate using an inkjet printer and then etched (see Japanese Patent Application Publication No. 56- 66089, Japanese Special Publication No. 56-157089, Japanese Special Publication No. 58-50794, Japanese Special Publication No. 6-237063). This method direct...
Claims
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IPC IPC(8): C09D11/101H05K3/10
CPCC09D11/30H05K2203/013C09D11/101B41M5/00C08F2/44C09D11/00H05K3/10
Inventor 志村优之依田健志宇敷滋
Owner TAIYO HLDG CO LTD