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Processing method of high-heat-conduction aluminum base copper clad board

A technology of aluminum-based copper-clad laminates and processing methods, applied in chemical instruments and methods, lamination devices, lamination auxiliary operations, etc., can solve problems such as unfavorable heat dissipation of circuit boards, and achieve convenient production operations, good thermal conductivity, and composite strength high effect

Inactive Publication Date: 2013-12-04
甄伟浪
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AI Technical Summary

Problems solved by technology

[0002] High thermal conductivity aluminum-based copper-clad laminate is an insulating composite board of heat-conducting aluminum plate and copper foil, so the heat-conducting aluminum plate and copper foil must be laminated with a layer of high-thermal-conduction adhesive film to meet the requirements. The components connected to the copper foil during use The heat is transferred to the aluminum plate for heat dissipation through the high thermal conductivity adhesive film, but the substrate of ordinary circuit board materials is resin and reinforced material, which is not conducive to heat dissipation, so it is necessary to design a processing method for aluminum-based copper clad laminates with high thermal conductivity

Method used

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Embodiment Construction

[0011] A method for processing a high thermal conductivity aluminum-based copper-clad laminate, comprising the following processing steps:

[0012] (1) Anodizing of aluminum plate: first put the aluminum plate into a sulfuric acid solution with a concentration of 10% for 2 minutes to degrease, then take out the aluminum plate and clamp the aluminum plate with a titanium clip and put it in a sulfuric acid solution with a concentration of 18%. Turn on the high-frequency DC power supply 16V200A, anodize the aluminum plate for 15 minutes, then take it out and put it in the aluminum plate cleaning machine to clean it and dry it;

[0013] (2) Use a roller pressing machine to roll and compound the high thermal conductivity film and the anodized aluminum plate. The compound pressure wheel maintains a constant temperature of 120°C, and the compound pressure is 100 kg / cm2. After compounding, wait for the aluminum plate to cool. Peel off the release film on the high thermal conductivity ...

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Abstract

The invention relates to a processing method of a high-heat-conduction aluminum base copper clad board. The method comprises the following steps: 1, anodizing an aluminum board; 2, carrying out rolling compounding of a high-heat-conduction glue film and the anodized aluminum board obtained in step 1 through using a roller pressing machine; 3, carrying out rolling compounding of a copper foil and the baked aluminum board pressed with the high-heat-conducting glue film by using the roller pressing machine; and 4, compounding a protection film with the lateral surface of the aluminum base board of a well compounded aluminum base copper clad board through using a protection film compounding machine to obtain the high-heat-conduction aluminum base copper clad board. Circuit boards produced through using the method have a high heat conduction performance, and the aluminum base board has a high compounding strength with the copper foil, so the production operation is convenient.

Description

technical field [0001] The invention relates to a processing method of a circuit board, in particular to a processing method of a high thermal conductivity aluminum-based copper-clad laminate. Background technique [0002] High thermal conductivity aluminum-based copper-clad laminate is an insulating composite board of heat-conducting aluminum plate and copper foil, so the heat-conducting aluminum plate and copper foil must be laminated with a layer of high-thermal-conduction adhesive film to meet the requirements. The components connected to the copper foil during use The heat is transferred to the aluminum plate for heat dissipation through the high thermal conductivity adhesive film, but the substrate of ordinary circuit board materials is resin and reinforced material, which is not conducive to heat dissipation, so it is necessary to design a processing method for aluminum-based copper clad laminates with high thermal conductivity . Contents of the invention [0003] ...

Claims

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Application Information

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IPC IPC(8): B32B37/06B32B37/10B32B38/16B32B38/18
Inventor 甄伟浪
Owner 甄伟浪
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