Method for preparing dual-hole-structure multi-hole copper materials strengthening boiling heat transfer function

A technology of enhanced boiling and double holes, which is applied in the field of metal porous materials, can solve the problems of low heat transfer efficiency, small number of vaporization cores, and small heat exchange surface area of ​​enhanced boiling, and is suitable for large-scale production, with a large number of vaporization cores, The effect of large heat exchange area

Active Publication Date: 2013-12-25
NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH
View PDF6 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat transfer surface area of ​​enhanced boiling heat transfer materials prepared by traditional methods is relatively small, the number of vaporization cores is small, and the frequency of bubble generation is low, which makes the enhanced boiling heat transfer efficiency low.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for preparing dual-hole-structure multi-hole copper materials strengthening boiling heat transfer function
  • Method for preparing dual-hole-structure multi-hole copper materials strengthening boiling heat transfer function
  • Method for preparing dual-hole-structure multi-hole copper materials strengthening boiling heat transfer function

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The preparation method of the double-pore structure porous copper material for enhanced boiling heat transfer in this embodiment comprises the following steps:

[0027] Step 1. Put the copper plate and the copper fiber felt into an ultrasonic cleaning machine filled with acetone for ultrasonic cleaning, and then place them in an oven for drying; the thickness of the copper plate is 2 mm, and the copper fiber felt has a wire diameter of 60 μm copper fiber rough felt;

[0028] Step 2. Spread the dried copper fiber felt in step 1 on the surface of the dried copper plate, then put the copper plate covered with copper fiber felt into the sintering furnace for sintering, and after natural cooling, attach a layer on the surface of the copper plate A copper fiber porous layer with a thickness of 2mm and a porosity of 90%; the sintering temperature is 900°C, and the sintering time is 1h;

[0029] Step 3, the KOH solution with a concentration of 1mol / L is the anode oxidation ele...

Embodiment 2

[0032] The preparation method of the double-pore structure porous copper material for enhanced boiling heat transfer in this embodiment comprises the following steps:

[0033] Step 1. Put the copper plate and the copper fiber felt into an ultrasonic cleaning machine filled with absolute ethanol for ultrasonic cleaning, and then place them in an oven for drying; the thickness of the copper plate is 2 mm, and the copper fiber felt is 2 mm in diameter. 160μm copper fiber sintered mat;

[0034] Step 2. Spread the dried copper fiber felt in step 1 on the surface of the dried copper plate, then put the copper plate covered with copper fiber felt into the sintering furnace for sintering, and after natural cooling, attach a layer on the surface of the copper plate A copper fiber porous layer with a thickness of 0.5mm and a porosity of 95%; the sintering temperature is 1000°C, and the sintering time is 2h;

[0035] Step 3: The KOH solution with a concentration of 0.5mol / L is used as t...

Embodiment 3

[0038] The preparation method of the double-pore structure porous copper material for enhanced boiling heat transfer in this embodiment comprises the following steps:

[0039] Step 1. Put the copper plate and the copper fiber felt into an ultrasonic cleaning machine filled with absolute ethanol for ultrasonic cleaning, and then place them in an oven for drying; the thickness of the copper plate is 2 mm, and the copper fiber felt is 2 mm in diameter. 30μm copper fiber rough felt;

[0040] Step 2. Spread the dried copper fiber felt in step 1 on the surface of the dried copper plate, then put the copper plate covered with copper fiber felt into the sintering furnace for sintering, and after natural cooling, attach a layer on the surface of the copper plate A copper fiber porous layer with a thickness of 3mm and a porosity of 80%; the sintering temperature is 850°C, and the sintering time is 2h;

[0041] Step 3, the KOH solution with a concentration of 2mol / L is the anode oxidation...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention provides a method for preparing dual-hole-structure multi-hole copper materials strengthening a boiling heat transfer function. The method comprises the following steps that (1) ultrasonic cleaning and drying are respectively carried out on a copper matrix and a copper fiber mat; (2) the copper fiber mat is laid on and covers the surface of the copper matrix, then sintering is carried out, and a copper fiber multi-hole layer is attached to the surface of the copper matrix; (3) anodic oxidation treatment is carried out on the copper matrix with the copper fiber multi-hole layer in an attached mode to obtain the dual-hole-structure multi-hole copper materials strengthening the boiling heat transfer function. The method is simple, reasonable in design, easy to implement, strong in operability and suitable for large-scale production. The multi-hole copper materials prepared through the method are of a dual-hole structure, the specific surface area is large, a large amount of nucleate boiling is achieved, the heat transfer effect is good, and important practical value and important popularization significance are achieved.

Description

technical field [0001] The invention belongs to the technical field of metal porous materials, and in particular relates to a preparation method of a double-pore structure porous copper material for enhanced boiling heat transfer. Background technique [0002] With the advancement of science and technology, people put forward higher and higher performance requirements for boiling heat transfer. At present, scholars from various countries have carried out extensive theoretical analysis, experimental research and technical exploration on boiling heat transfer, and proposed a variety of theories and methods to enhance boiling heat transfer. Among them, the most effective method of enhancing boiling heat transfer is to use various types of enhanced boiling. heat transfer material. Existing enhanced boiling heat transfer materials usually have various shapes of grooves, fins or porous surfaces. Among them, enhanced boiling heat transfer materials with porous surfaces are known f...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/01B32B15/14B32B15/20C25D11/34
Inventor 支浩汤慧萍朱纪磊李广忠李纲王建忠敖庆波马军李爱军许忠国
Owner NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap