Silicon wafer cutting fluid and preparation method thereof

A silicon chip cutting fluid and solution technology, which is applied in the petroleum industry, additives, lubricating compositions, etc., can solve the problems of filter bag clogging, increased production costs, scrapping of the entire knife mortar, etc., to reduce pH value drop and increase storage time Effect

Active Publication Date: 2015-03-25
KONCA SOLAR CELL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the mortar cutting process, the mortar will agglomerate, the pipeline pressure will be too high, and the filter bag will be blocked, which will affect the normal cutting production. In severe cases, the whole knife mortar may be scrapped, which greatly increases the production cost.

Method used

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  • Silicon wafer cutting fluid and preparation method thereof
  • Silicon wafer cutting fluid and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A kind of silicon chip cutting liquid, it is mainly made up of following raw material by weight percentage:

[0034] Cutting fluid commonly used raw materials 99wt%

[0035] Formamide solution 1wt%.

[0036] Wherein, the concentration of the formamide solution is 99.50%.

[0037] Its preparation method is:

[0038] 1) First, calculate the required amount of formamide solution according to the weight of silicon wafer cutting fluid to be prepared;

[0039] 2) Stir the silicon wafer cutting solution first, slowly add the formamide solution during the stirring process, wait for all the solution to be poured and then stir evenly for 5 minutes;

[0040] 3) The prepared silicon wafer cutting fluid should be immediately stored in cans and sealed to avoid long-term exposure to the air.

Embodiment 2

[0042] A kind of silicon chip cutting liquid, it is mainly made up of following raw material by weight percentage:

[0043] Cutting fluid commonly used raw materials 80wt%

[0044] Formamide solution 20wt%

[0045] Wherein, the concentration of the formamide solution is 99.50%.

[0046] Its preparation method is the same as Example 1, the difference is that the stirring time is 3min.

Embodiment 3

[0048] A kind of silicon chip cutting liquid, it is mainly made up of following raw material by weight percentage:

[0049] Cutting fluid commonly used raw materials 95wt%

[0050] Formamide solution 5wt%

[0051] Wherein, the concentration of the formamide solution is 99.50%.

[0052] Its preparation method is the same as Example 1, the difference is that the stirring time is 15min.

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Abstract

The invention relates to silicon wafer cutting fluid and a preparation method thereof. The silicon wafer cutting fluid mainly comprises PEG (polyethylene glycol), surfactant, lubricant, a penetrant and a chelating agent, as well as formamide solution. The method comprises the steps of adding formamide solution into the silicon wafer cutting fluid, agitating, sealing and storing. A certain proportion of formamide solution is added in the silicon cutting fluid, so that the influence that the pH of the cutting fluid is reduced in storage process can be effectively reduced, the chemical property stability and uniformity of PEG can be guaranteed so as to provide guarantee for the cutting process.

Description

technical field [0001] The invention relates to a silicon wafer cutting fluid and a preparation method thereof. Background technique [0002] In the cutting process of photovoltaic solar silicon wafers, silicon wafer cutting fluid is an auxiliary consumable product that must be used in the process of silicon wafer cutting, and its consumption is expanding with the growth of the photovoltaic solar energy industry and China's silicon wafer processing industry. [0003] The cutting mortar is obtained by mixing the cutting fluid and the cutting sand (usually silicon carbide) in a certain proportion, and the cutting steel wire is used as the carrier to drive the mortar to cut the silicon block into silicon wafers. Multi-wire cutting is the process of using side-by-side steel wires to bring the cutting mortar into the cutting gap of the silicon block during the movement, and process the silicon block into silicon wafers through the tumbling action of the abrasive in the mortar. I...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C10M133/16
Inventor 王欣周凯鸣蔺雷亭刘宏华
Owner KONCA SOLAR CELL
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