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Silicon wafer cutting fluid and preparation method thereof

A silicon chip cutting fluid and solution technology, applied in the petroleum industry, additives, lubricating compositions, etc., can solve the problems of filter bag clogging, increased production costs, scrapping of the whole knife mortar, etc., to reduce the pH value drop and increase storage time Effect

Active Publication Date: 2013-12-25
KONCA SOLAR CELL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the mortar cutting process, the mortar will agglomerate, the pipeline pressure will be too high, and the filter bag will be blocked, which will affect the normal cutting production. In severe cases, the whole knife mortar may be scrapped, which greatly increases the production cost.

Method used

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  • Silicon wafer cutting fluid and preparation method thereof
  • Silicon wafer cutting fluid and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A silicon wafer cutting fluid is mainly composed of the following raw materials in percentage by weight:

[0034] Common raw materials for cutting fluid 99wt%

[0035] Formamide solution 1wt%.

[0036] Wherein, the concentration of the formamide solution is 99.50%.

[0037] Its preparation method is:

[0038] 1) First, calculate the amount of formamide solution required according to the weight of the wafer cutting fluid to be prepared;

[0039] 2) Stir the wafer cutting solution first, slowly add the formamide solution during the stirring process, and stir evenly for 5 minutes after all the solution is poured;

[0040] 3) The prepared silicon wafer cutting fluid should be immediately sealed and stored in a can to avoid prolonged exposure to the air.

Embodiment 2

[0042] A silicon wafer cutting fluid is mainly composed of the following raw materials in percentage by weight:

[0043] Common raw materials for cutting fluid 80wt%

[0044] Formamide solution 20wt%

[0045] Wherein, the concentration of the formamide solution is 99.50%.

[0046] The preparation method is the same as that in Example 1, except that the stirring time is 3 min.

Embodiment 3

[0048] A silicon wafer cutting fluid is mainly composed of the following raw materials in percentage by weight:

[0049] Common raw materials for cutting fluid 95wt%

[0050] Formamide solution 5wt%

[0051] Wherein, the concentration of the formamide solution is 99.50%.

[0052] The preparation method is the same as that in Example 1, except that the stirring time is 15 min.

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PUM

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Abstract

The invention relates to silicon wafer cutting fluid and a preparation method thereof. The silicon wafer cutting fluid mainly comprises PEG (polyethylene glycol), surfactant, lubricant, a penetrant and a chelating agent, as well as formamide solution. The method comprises the steps of adding formamide solution into the silicon wafer cutting fluid, agitating, sealing and storing. A certain proportion of formamide solution is added in the silicon cutting fluid, so that the influence that the pH of the cutting fluid is reduced in storage process can be effectively reduced, the chemical property stability and uniformity of PEG can be guaranteed so as to provide guarantee for the cutting process.

Description

technical field [0001] The invention relates to a silicon wafer cutting liquid and a preparation method thereof. Background technique [0002] In the process of photovoltaic solar wafer cutting, wafer cutting fluid is a kind of auxiliary consumable product that must be used in the silicon wafer cutting process. [0003] The cutting mortar is obtained by mixing the cutting fluid and the cutting sand (usually silicon carbide) in a certain proportion, and the cutting steel wire is used as a carrier to drive the mortar to cut the silicon block into silicon wafers. Multi-wire cutting is a process in which the side-by-side steel wire is used to bring the cutting mortar into the cutting gap of the silicon block during the movement process, and the silicon block is processed into a silicon wafer by the rolling action of the abrasive in the mortar. In the case of stable operation of the slicing machine and personnel, the quality of silicon wafer processing and the stability of the c...

Claims

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Application Information

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IPC IPC(8): C10M133/16
Inventor 王欣周凯鸣蔺雷亭刘宏华
Owner KONCA SOLAR CELL
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