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OLED packaging device

A technology for packaging devices and substrates, which is applied in the manufacturing of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc.

Active Publication Date: 2013-12-25
SHANGHAI UNIV
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  • Summary
  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

When the laser is packaging the organic electrical laser display device, it is difficult to align the laser with the measurement end of the thermocouple during the detection process, resulting in a large measurement error
The temperature of packaging bonding is difficult to detect and thus difficult to control, resulting in excessive thermal stress on the packaged glass substrate, which greatly affects the yield of products

Method used

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  • OLED packaging device
  • OLED packaging device
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Embodiment Construction

[0028] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0029] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...

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Abstract

An OLED packaging device is used for packaging an OLED substrate and comprises a laser generator, a die used for containing the OLED substrate, infrared ray convergence modules, thermocouples and an upper computer. A slit coincident with a packaging path is formed in one side surface, close to the laser generator, of the die. Laser can illuminate the packaging path through the slit and heat a glass cement material. An upper substrate radiates infrared rays, and the infrared rays are transmitted from the slit of the die and converged by the infrared ray convergence modules. The thermocouples are respectively arranged on light exit ports of the infrared ray convergence modules and collect the temperature information of the infrared rays. The upper computer is in communication connection with the thermocouples, receives the temperature information and controls the transmitting power of the laser generator according to the temperature information. The OLED packaging device controls the power of the laser, optimizes the packaging temperature curve, then reduces heat stress on the substrate in the packaging process and improves the yield in the packaging process of the OLED substrate.

Description

technical field [0001] The invention relates to a packaging device, in particular to an OLED packaging device. Background technique [0002] OLED (Organic Light-Emitting Diode) has the characteristics of self-luminescence, simple structure, ultra-thin, fast response, wide viewing angle, low power consumption and flexible display. The OLED substrate includes upper and lower OLED substrates and glass glue. The upper and lower OLED substrates are packaged together by glass glue. Laser scanning packaging often heats the glass glue by laser, and after melting, the upper and lower OLED substrates are packaged. When the laser is packaging the organic electrical laser display device, it is difficult to align the laser with the measurement end of the thermocouple during the detection process, resulting in a large measurement error. The temperature of packaging and bonding is difficult to detect and thus difficult to control, resulting in excessive thermal stress on the glass subst...

Claims

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Application Information

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IPC IPC(8): H01L51/56
Inventor 张建华段玮
Owner SHANGHAI UNIV
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