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Preparation method of nano silver-coated copper powder

A technology of coating copper and nano-silver, applied in liquid chemical plating, coating, metal material coating process, etc., can solve the problems of poor oxidation resistance, high price of nano-silver, and high cost, and achieve cost reduction and improvement. Antioxidant ability, the effect of improving antioxidant ability

Active Publication Date: 2015-04-29
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the existing nano-silver used as an interconnect material for electronic packaging is expensive and high in cost, and the problem of poor oxidation resistance exists when copper is used as an interconnect material for electronic packaging instead of nano-silver. Preparation method of nano-silver coated copper powder

Method used

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  • Preparation method of nano silver-coated copper powder
  • Preparation method of nano silver-coated copper powder
  • Preparation method of nano silver-coated copper powder

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specific Embodiment approach 1

[0014] Embodiment 1: This embodiment is a preparation method of nano-silver coated copper powder, which is specifically completed according to the following steps:

[0015] 1. Copper powder pretreatment: ① Add copper powder to dilute hydrochloric acid, use an ultrasonic cleaner at a temperature of 40°C to 60°C to ultrasonically treat the dilute hydrochloric acid solution containing copper powder for 2min to 5min, and obtain copper-containing powdered dilute hydrochloric acid solution; ②Use deionized water at room temperature to wash the dilute hydrochloric acid solution containing copper powder after ultrasonic cleaning 2 to 3 times to obtain copper powder after deionized water cleaning; ③Copper powder washed with deionized water Add it into acetone, and use an ultrasonic cleaning machine with a temperature of 40°C to 60°C to ultrasonically treat the acetone solution containing copper powder for 5min to 10min to obtain the acetone solution containing copper powder after ultraso...

specific Embodiment approach 2

[0021] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the copper powder described in step 1 is copper powder with a particle size of 5 μm˜20 μm. Other steps are the same as in the first embodiment.

[0022] The copper powder with a particle diameter of 5 μm to 20 μm described in this embodiment has a purity of 99.9999%.

specific Embodiment approach 3

[0023] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that the ultrasonic cleaning machine with a temperature of 50°C described in step one (1) carries out ultrasonic treatment on the dilute hydrochloric acid solution containing copper powder for 3 minutes, Obtain the dilute hydrochloric acid solution containing copper powder after ultrasonication. Other steps are the same as those in Embodiment 1 or 2.

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Abstract

The invention provides a preparation method of nano silver-coated copper powder, relates to a preparation method of metal core-shell composite powder, and aims to solve the problems that the existing nano silver used as an interconnection material for electronic packaging is expensive and high in cost and copper substituted for the nano silver to be used as the interconnection material for electronic packaging is poor in oxidation resistance. The preparation method comprises the following steps: 1, pretreating copper powder; 2, preparing a sodium borohydride reducing solution; and 3, stirring and drying. The preparation method has the following advantages: 1, nano silver particles are coated on the surface of the micron-sized copper powder, thus lowering the cost and improving the oxidation resistance of the copper powder; and 2, the nano silver particles are coated on the surface of the micron-sized copper powder, so that the surface of the copper powder has certain property of the nano particles, thus greatly improving the oxidation resistance of the copper powder. The prepared nano silver-coated copper powder is used as the interconnection material for electronic packaging.

Description

technical field [0001] The invention relates to a preparation method of a metal core-shell composite powder. Background technique [0002] Due to the high degree of heat dissipation per unit volume of high-power electronic components, the operating temperature rises sharply. If traditional welding materials and conductive adhesives are to meet the high temperature resistance conditions during use, they will not be able to cope with the aggravated thermal mismatch of the welding base metal caused by the sharp rise in temperature during welding, resulting in serious reliability problems. Therefore, high-power components urgently need interconnect materials for low-temperature connection and high-temperature applications to meet the requirements for high performance and high reliability. Nanomaterials with special electrical, mechanical, optical, magnetic and chemical properties provide good prospects for the innovation and development of interconnect materials. [0003] The ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F1/02C23C18/44
Inventor 林铁松何鹏曹洋王君
Owner HARBIN INST OF TECH