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Manufacturing method of pre-packaged lead frame

A manufacturing method and a technology of encapsulating leads, which are applied in the manufacture of semiconductor/solid-state devices, electrical components, and electrical solid-state devices, etc., can solve problems such as different degrees of bending, deformation of integrated circuit components, and uneven surfaces, so as to ensure surface flatness , Guarantee the overall performance and reduce the production cost

Inactive Publication Date: 2014-01-08
NINGBO KANGQIANG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The manufacturing method of the lead frame has the following defects: (1) the price of the adhesive tape that needs to be used when pasting the adhesive tape on the back is relatively expensive, resulting in high manufacturing cost of the lead frame; (2) the material of the adhesive tape is plastic, and the base material is a copper alloy sheet, plastic The thermophysical properties and thermal expansion coefficients of copper alloys are different, resulting in different bending degrees of the base material and tape when the temperature rises in the subsequent wire welding process, resulting in deformation and uneven surface of the fabricated integrated circuit components, affecting integrated circuits. Overall Performance of Components

Method used

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  • Manufacturing method of pre-packaged lead frame

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Embodiment Construction

[0024] The present invention will be further described in detail below in conjunction with the examples, but not limited thereto.

[0025] This embodiment provides a method for manufacturing an integrated circuit element that includes a method for manufacturing a pre-encapsulated lead frame of the present invention. The copper alloy sheet 1 is used as the base material, and the following steps are followed in sequence:

[0026] (1) Etching: Etching the base material of the copper alloy sheet 1 to obtain figure 1 As shown in (a), the specific method of etching is the same as that in the prior art. This embodiment adopts the method of etching through and half etching.

[0027] (2) Pre-encapsulation: It is carried out on the concave-convex mold. The surface of the concave-convex mold is provided with a groove matching the size and position of the etching groove formed by etching, and is provided with a flow channel communicating with the groove. The pre-encapsulation process In...

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Abstract

The invention provides a manufacturing method of a pre-packaged lead frame. The manufacturing method of the pre-packaged lead frame comprises the following steps of etching; pre-packaging an etching area of a base material by utilizing an epoxy resin material; removing the epoxy resin remained on the surface of the base material through electrolysis or mechanical polishing; electroplating an electroplating area of the front surface of the base material. According to the manufacturing method of the pre-packaged lead frame, which is provided by the invention, the manufacturing cost of the lead frame is low; when a lead frame manufactured by the method provided by the invention is used for manufacturing integrated circuit assemblies, the obtained integrated circuit assemblies have smooth surfaces, and the integral performance is ensured.

Description

technical field [0001] The invention relates to the technical field of lead frames, in particular to a method for manufacturing a pre-encapsulated lead frame. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is the basic component for the production of integrated circuit semiconductor components. The production of the lead frame in the prior art generally uses copper alloy sheets as the base material, and after etching, electroplating, and tape on the back, it becomes a lead frame. After a series of steps such as molding, integrated circuit (IC) components are made. The manufacturing method of the lead frame has the following defects: (1) the price of the adhesive tape that needs to be used when pasting the adhesive tape on the back is relatively expensive, resulting in high manufacturing cost of the lead frame; (2) the material of the adhesive tape is plastic, and the base material is a copper alloy sheet, plastic The thermophysical...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48
CPCH01L2224/48091H01L2224/48247H01L2924/181H01L2924/00012H01L2924/00014H01L21/4821
Inventor 郑康定黎超丰邓道斌曹光伟李昌文
Owner NINGBO KANGQIANG ELECTRONICS CO LTD
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