Manufacturing method of pre-packaged lead frame

A manufacturing method and a technology of encapsulating leads, which are applied in the manufacture of semiconductor/solid-state devices, electrical components, and electrical solid-state devices, etc., can solve problems such as different degrees of bending, deformation of integrated circuit components, and uneven surfaces, so as to ensure surface flatness , Guarantee the overall performance and reduce the production cost
CN103500713AInactive Publication Date: 2014-01-08NINGBO KANGQIANG ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
NINGBO KANGQIANG ELECTRONICS CO LTD
Publication Date
2014-01-08
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The invention provides a manufacturing method of a pre-packaged lead frame. The manufacturing method of the pre-packaged lead frame comprises the following steps of etching; pre-packaging an etching area of a base material by utilizing an epoxy resin material; removing the epoxy resin remained on the surface of the base material through electrolysis or mechanical polishing; electroplating an electroplating area of the front surface of the base material. According to the manufacturing method of the pre-packaged lead frame, which is provided by the invention, the manufacturing cost of the lead frame is low; when a lead frame manufactured by the method provided by the invention is used for manufacturing integrated circuit assemblies, the obtained integrated circuit assemblies have smooth surfaces, and the integral performance is ensured.
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Description

technical field

[0001] The invention relates to the technical field of lead frames, in particular to a method for manufacturing a pre-encapsulated lead frame. Background technique

[0002] As the chip carrier of integrated circuits, the lead frame is the basic component for the production of integrated circuit semiconductor components. The production of the lead frame in the prior art generally uses copper alloy sheets as the base material, and after etching, electroplating, and tape on the back, it becomes a lead frame. After a series of steps such as molding, integrated circuit (IC) components are made. The manufacturing method of the lead frame has the following defects: (1) the price of the adhesive tape that needs to be used when pasting the adhesive tape on the back is relatively expensive, resulting in high manufacturing cost of the lead frame; (2) the material of the adhesive tape is plastic, and the base material is a copper alloy sheet, plastic The thermophysical...

Claims

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