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A process for extracting gold and silver from waste circuit board chips and integrated blocks

A technology of waste circuit boards and integrated blocks, applied in the direction of improving process efficiency, etc., can solve the problems of large pollution in pyrotechnic processes, and achieve the effect of easy-to-understand and simple process operation

Inactive Publication Date: 2016-02-17
王金良
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the recycling process of gold-containing waste often adopts pyrotechnics, which has been eliminated due to too much pollution.

Method used

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Embodiment 1

[0014] A process for extracting gold and silver from waste circuit board chips and integrated blocks, comprising the following steps:

[0015] A. Remove electronic pins: Take waste circuit board chips and integrated blocks, soak them in 4mol / L nitric acid solution according to the solid-liquid ratio of 1:2, remove the electronic pins outside the chip integrated blocks, and dissolve them until the electronic pins are dissolved , then rinse the chips and integrated blocks with clean water, crush them to 80 mesh with a pulverizer, put them in a carbonization furnace, carbonize at a temperature of 400°C for 10-30 minutes, and cool until the black powder turns white, because the chips and integrated blocks are basically They are all encapsulated with solid epoxy resin, and only when the epoxy resin is destroyed can the leaching of gold be facilitated.

[0016] B. Leaching of silver, copper and base metals: Pour the carbonized chip powder into a closed reaction container, put it int...

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PUM

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Abstract

The invention aims at providing a technology for extracting gold and silver from chips and manifold blocks of waste circuit boards, which is tiny in pollution, simple and easy-to-understand in technological operation, and environment-friendly. The technology comprises the following steps: A, removing electronic feet; B, leaching silver, copper and base metal; C, extracting silver; D, leaching gold from filter residue; E, reducing the gold. The raw materials disclosed by the invention mainly are recovered gold and silver inside the chips and the manifold blocks on the weeded-out, discarded and waste circuit boards in an electronic equipment factory; the gold and silver manly exist in the chips in other metals such as silicon crystal gold leads, thick-film gold paste, gold alloys, or pure spun gold or the like. A wet process with tiny pollution is adopted; the technological operation is simple and easy to understand; a little of nitric oxide generated in an operation is absorbed by alkali, so as to achieve the target of environmental protection.

Description

technical field [0001] The invention relates to a process for extracting gold and silver from waste circuit board chips and integrated blocks. Background technique [0002] As we all know, the key to the recovery of gold from gold-bearing waste is to try to separate gold from most other materials (including various organic substances, base metal substances and other precious metal substances other than gold). At present, the recycling process of gold-containing waste often adopts pyrotechnics, which has been eliminated due to too much pollution. Contents of the invention [0003] In order to solve the above technical problems, the present invention provides a process for extracting gold and silver from waste circuit board chips and integrated blocks with minimal pollution, simple and easy-to-understand process operation, and environmental protection. [0004] A process for extracting gold and silver from waste circuit board chips and integrated blocks of the present inven...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22B7/00C22B15/00C22B11/00
CPCY02P10/20
Inventor 王金良
Owner 王金良
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