A fully automatic dispensing robot

Abstract

A disclosed full-automatic adhesive dispensing robot is characterized by comprising an adhesive dispensing robot main machine, an adhesive dispensing robot programming device and an adhesive dispensing controller; the adhesive dispensing robot main machine comprises a machine frame, a main control system arranged on the machine frame, a driving system connected with the output terminal of the main control system, a mechanical transmission device which is driven by the driving system and provided with an electric motor, an adhesive barrel provided with an adhesive dispensing sleeve cap, and an adhesive barrel clamp; the mechanical transmission device is connected with the adhesive barrel clamp; the adhesive barrel is connected with a gas driving system which drives an adhesive in the adhesive barrel to flow from the adhesive dispensing sleeve cap; the gas driving system is connected with and controlled by the adhesive dispensing controller; the adhesive dispensing robot programming device is connected with the signal input terminal of the main control system. The full-automatic adhesive dispensing robot is simple in structure and convenient to operate, and has good popularization value.

Description

technical field [0001] The invention relates to the technical field of electronic packaging equipment, and more specifically relates to a glue dispensing robot. Background technique [0002] With the development of electroacoustic electronic packaging technology, dispensing technology, as the main process in advanced electronic manufacturing, has become one of the important scientific and technological issues. Dispensing (Dispensing) process is to point a microfluid of ideal size (such as flux, conductive epoxy resin or adhesive, etc.) on the appropriate position of the workpiece (chip, electronic components, etc.) to achieve mechanical or Electrically reliable connection. Dispensing a certain amount of colloid to the workpiece seems to be a very simple task, but because the dispensing process involves various media such as gas and liquid, the adhesive used is a non-Newtonian fluid, and its complex and changeable properties It is difficult to guarantee the performance and ...

AI Technical Summary

Problems solved by technology

Disadvantages: Working with pulsating compressed air will heat the colloid and change its viscosity and colloid size; as the amount of glue in the syringe changes, the amount of glue dispensed will change accordingly, and the response speed is slow

Disadvantages: This technology is also sensitive to the viscosity of the colloid, and the repeated rotation of the thread will reduce the viscosity; the consistency of the dispensing amount is affected by the liquid level height, air pressure, colloid viscosity, temperature, etc.

Disadvantages: using mechanical movement to dispense glue, the speed is not fast; the amount of glue dispensed is not easy to adjust

[0009] At present, the technology of foreign industrial automatic dispensing equipment is relatively mature. The main manufacturers include Japan's Musashi (MUSASHI), Iwashita (IWASHITA), South Korea's Sejong, Panshi (BANSOEK), and the United States. Musashi's dispensing machines occupy a relatively large market share in China, but the functions are not perfect. The operating system of the human-computer interaction interface is an English system, which is difficult for domestic operators to adapt to, and the price of foreign products is higher than that of domestic products. The selling price is about 1 / 3 higher, which is difficult to meet the requirements of domestic enterprises

In terms of dispensing technology, most foreign manufacturers currently use contact dispensing, mainly using time pressure to control the glue. Although non-contact dispensing technology is relatively advanced, it is expensive and cannot meet the needs of the general domestic market.

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