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Adhesive for silicone mica tape and preparation method of adhesive

A silicone rubber, silicone technology, applied in the direction of adhesives, coatings, etc., can solve the problems of inability to undergo cross-linking and curing, unfavorable electrical insulation performance of motors, and reduce the final performance of silicone-less tapes, and achieve good chemical compatibility. properties, high viscosity, and the effect of improving insulation performance

Active Publication Date: 2014-01-22
ZHUZHOU TIMES ELECTRIC INSULATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the disadvantage is that the silicon-hydrogen bonds in the adhesive are easy to react with uneliminated hydroxyl groups, water, organic acids, alcohols, etc. during production and storage, thereby reducing the final performance of the silicone-less adhesive tape, which is not conducive to the electrical properties of the motor. Insulation properties
But the disadvantage is that the silicone pressure-sensitive adhesive does not contain groups that can react with the solvent-free silicone impregnating varnish, so that cross-linking and curing cannot occur, and it is not suitable for insulating structures that require high electrical insulation

Method used

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  • Adhesive for silicone mica tape and preparation method of adhesive
  • Adhesive for silicone mica tape and preparation method of adhesive
  • Adhesive for silicone mica tape and preparation method of adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] An adhesive for silicone-less adhesive tape of the present invention is prepared by dehydration polycondensation of phenyl vinyl silicone rubber and vinyl MQ silicone resin with a mass ratio of 10:11 under the action of dibutyltin dilaurate.

[0025] In phenyl vinyl silicone rubber, the molar ratio of methyl, phenyl, vinyl is 100:20:3, and the dynamic viscosity of phenyl vinyl silicone rubber is 8×10 4 cP.

[0026] The general molecular structure formula of phenyl vinyl silicone rubber in this embodiment is:

[0027]

[0028] Among them, a, b, and c are all positive integers.

[0029] In vinyl MQ silicone resin, the molar ratio of M / Q is 0.7:1, and the molar ratio of methyl to vinyl is 100:7.

[0030] A kind of preparation method of the silicone few adhesive tape adhesive of above-mentioned present embodiment, comprises the following steps:

[0031] 100g of phenylvinyl silicone rubber is completely dissolved in 40g of toluene, the molar ratio of methyl, phenyl, vi...

Embodiment 2

[0043] An adhesive for silicone-less adhesive tape of the present invention is prepared by dehydration polycondensation of phenylvinyl silicone rubber and vinyl MQ silicone resin with a mass ratio of 10:10 under the action of a catalyst dibutyltin dilaurate.

[0044] In phenyl vinyl silicone rubber, the molar ratio of methyl, phenyl and vinyl is 100:33:7, and the dynamic viscosity of phenyl vinyl silicone rubber is 8.5×10 4 cP.

[0045] The general molecular structure formula of phenyl vinyl silicone rubber in this embodiment is:

[0046]

[0047] Among them, a, b, and c are all positive integers.

[0048]In vinyl MQ silicone resin, the molar ratio of M / Q is 0.8:1, and the molar ratio of methyl to vinyl is 100:6.

[0049] A kind of preparation method of the silicone few adhesive tape adhesive of above-mentioned present embodiment, comprises the following steps:

[0050] 100g of phenylvinyl silicone rubber is completely dissolved in 80g of toluene, the molar ratio of meth...

Embodiment 3

[0052] An adhesive for silicone-less adhesive tape of the present invention is prepared by dehydration polycondensation of phenylvinyl silicone rubber and vinyl MQ silicone resin with a mass ratio of 10:9 under the action of a catalyst dibutyltin dilaurate.

[0053] In phenylvinyl silicone rubber, the molar ratio of methyl, phenyl, and vinyl is 100:10:6, and the dynamic viscosity of phenylvinyl silicone rubber is 6.8×10 4 cP.

[0054] The general molecular structure formula of phenyl vinyl silicone rubber in this embodiment is:

[0055]

[0056] Among them, a, b, and c are all positive integers.

[0057] In vinyl MQ silicone resin, the molar ratio of M / Q is 0.85:1, and the molar ratio of methyl to vinyl is 100:7.

[0058] A kind of preparation method of the silicone few adhesive tape adhesive of above-mentioned present embodiment, comprises the following steps:

[0059] 100g of phenyl vinyl silicone rubber is completely dissolved in 80g of toluene, the molar ratio of met...

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Abstract

The invention discloses an adhesive for a silicone mica tape and a preparation method of the adhesive. The adhesive for the silicone mica tape is prepared from phenyl vinyl organic silicon rubber and MQ silicon resin through dehydration condensation under the action of a catalyst. The preparation method comprises the steps of completely dissolving the phenyl vinyl organic silicon rubber and the MQ silicon resin in an organic solvent, respectively; mixing and stirring a phenyl vinyl organic silicon rubber solution, a vinyl MQ silicon resin solution and the catalyst in a reactor, heating to 100-120 DEG C and reacting, and discharging when solid content is 50-60% and dynamic viscosity at 23 DEG C is (2-8)*10<4>cP, thus obtaining the adhesive for the silicone mica tape. The adhesive for the silicone mica tape has excellent physical compatibility and chemical compatibility with solvent-free silicone impregnating varnish, and the preparation method is simple and convenient, and low in cost.

Description

technical field [0001] The invention relates to an adhesive for silicone-less tapes and a preparation method thereof, in particular to an adhesive for silicone-less tapes that can be used in 200-level insulation structures and a preparation method thereof, and is mainly used for traction motors such as high-power locomotives. Background technique [0002] At present, the traction motors of high-power locomotives generally adopt the 200-level insulation structure of the silicone system. Among them, the most important material is the solvent-free silicone dipping varnish and the silicone adhesive tape used in conjunction with it. Solvent-free silicone impregnating varnish is a pure silicone resin containing phenyl, silicon vinyl and silicon-hydrogen bonds. The curing mechanism is: when heated, a platinum catalyst catalyzes vinyl and silicon-hydrogen bond addition curing. The core technology of silicone-less adhesive tape lies in the adhesive for silicone-less adhesive tape wh...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09D183/04C09D5/25
Inventor 陈晓陈磊曾智周光红陈子荣
Owner ZHUZHOU TIMES ELECTRIC INSULATION
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