Heat-conduction and electric-conduction hot melt glue and preparation method thereof

A technology of conductive hot-melt adhesive and hot-melt adhesive, which is applied in the direction of conductive adhesives, adhesives, adhesive additives, etc., to achieve the effects of less addition, improved compatibility, and low elasticity and bonding strength

Inactive Publication Date: 2014-01-29
SHENYANG JIANZHU UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Proportion (quality points): ESBS 5

[0014] SEBS 25

[0015] Hydrogenated C9 petroleum resin 20

[0016] Terpene resin 30

[0017] naphthenic oil 16

[0018] Graphene 3

[0019] Antioxidant 1010 1

[0020] Operation steps: Add ESBS, SEBS, C9 petroleum resin, terpene resin, naphthenic oil and antioxidant 1010 into the mixing chamber of the torque rheometer according to the above ratio. The parameters of the blending process are: blending temperature 140°C, blending time 40 min, rotation speed 50 r / min. The solid graphene powder was divided into 3 equal parts and added in 3 times with an interval of 10 minutes each time. After the blending is completed, a black heat-conducting and electrically-conducting hot-melt adhesive is obtained. The electrical conductivity of the hot melt adhesive is 0.15s / m, the thermal conductivity is 1.5w / m.k, 180 0 The ...

Embodiment 2

[0022] Proportion (quality points): ESBS 8

[0023] SEBS 32

[0024] Hydrogenated rosin 10

[0025] Terpene resin 30

[0026] Naphthenic oil 15.5

[0027] Graphene 3.5

[0028] Antioxidant 1010 1

[0029] Operation steps: add ESBS, SEBS, C9 petroleum resin, terpene resin, naphthenic oil and antioxidant 1010 into the internal mixer according to the above ratio, keep at 140°C until the above mixture is melted, add solid graphene powder, and knead After 40 minutes, black heat-conducting and electrically-conducting hot-melt adhesives were obtained from the discharge. The electrical conductivity of the hot melt adhesive is 0.3s / m, the thermal conductivity is 2.6w / m.k, 180 0 The peel strength was 10.6 N / cm.

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Abstract

The invention relates to a heat-conduction and electric-conduction hot melt glue and a preparation method thereof. The hot melt glue is high in heat-conduction and electric-conduction properties under a precondition that the elasticity and bonding strength of the original hot melt glue; the heat conduction coefficient reaches more than 2.0w/m.k. According to the hot melt glue, base materials comprise styrene thermoplastic elastomers (SEBS) and styrene-butadiene-styrene thermoplastic elastomers (ESBS) modified by epoxidation; a thickening agent comprises two of hydrogenated rosin, terpene resin and C9 petroleum resin; a filler is graphene solid powder with heat-conduction and electric-conduction functions; the addition amount of the base materials accounts for 30-40%; the addition amount of thickening resin accounts for 30-50%; the addition amount of the solid graphene powder accounts for 1.5-3.5%; the addition amount of the other accessory ingredient naphthenic oil accounts for 15-18%; the addition amount of an antioxidant accounts for 1-2%; the heat-conduction and electric-conduction hot melt glue is prepared from the components of the hot melt glue through a melt blending method.

Description

technical field [0001] The invention relates to a heat-conducting and electrically-conducting hot-melt adhesive and a preparation method thereof, belonging to the technical field of adhesive preparation technology. Background technique [0002] Adhesives must have a certain degree of thermal and / or electrical conductivity in certain applications, such as in the electrical or electronic industries. Conductivity, which is especially important when the adhesive enables electrical current to flow between components and must withstand EMI and RFI. Thermal conductivity is also very important in some highly integrated electronic applications. In these applications, the heat generated by the components must be transferred out of the electronic package through heat pipes or other means. In adhesive systems, thermal conduction is also a method of cooling, while thermal conduction can also reduce stress during the curing cycle or due to different operating temperatures. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J153/02C09J9/02C09J11/04
Inventor 刘运学范兆荣谷亚新王晓丹刘阳李兰
Owner SHENYANG JIANZHU UNIVERSITY
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