Sapphire-based led packaging structure and packaging method

Abstract

The invention relates to an LED (light emitting diode) packaging structure with a sapphire substrate. The LED packaging structure with the sapphire substrate comprises the sapphire substrate and an LED chip, wherein the sapphire substrate is provided with a first metal electrode layer and a second metal electrode layer which are insulated from each other; the LED chip is reversely arranged on the first metal electrode layer and the second metal electrode layer; a positive pole and a negative pole of the LED chip are respectively connected with the first metal electrode layer and the second metal electrode layer; a positive pole metal bonding pad and a negative pole metal bonding pad are respectively arranged on the lower surface of the sapphire substrate, and are electrically connected with the first metal electrode layer and the second metal electrode layer on the upper surface of the sapphire substrate through gold wires; and a colloid lens is arranged on the upper surface of the sapphire substrate. According to the packaging structure, the LED chip is directly arranged on the surface of the sapphire substrate reversely, and the process cost and the process difficulty are reduced; and moreover, a PT (platinum) plate or a ceramic plate is replaced by the sapphire substrate, and the light extraction efficiency can be obviously improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor lighting devices, and more specifically, the invention relates to a high-brightness sapphire-based LED packaging structure and a packaging method thereof. Background technique [0002] LED, that is, light-emitting diode, is a semiconductor light-emitting device, which is widely used as indicator lights, display screens, etc. It has the advantages of high light efficiency, no radiation, long life, low power consumption and environmental protection. At present, a traditional way of forming white LEDs is to excite phosphors with blue light or ultraviolet chips. The light emitted by the chips under the current drive excites phosphors to produce visible light in other bands, and each part mixes colors to form white light; and with the rapid development of white LED technology , which makes the application field of LED more and more extensive. From outdoor lighting such as street lamps and car lig...

AI Technical Summary

Problems solved by technology

However, the current LED surface mount structure has the following problems: Since the packaging frame is made of a metal frame as the substrate, and then sealed and cut by injecting plastic grooves or molding, the temperature resistance is not good. , heat dissipation is not ideal

In addition, due to the structure of mounting the LED chips face-up and using gold wires to connect the electrodes, gold wire connection failure is often the most common failure mode in the production and use of LEDs.

Moreover, BT or ceramic substrate materials are usually used in the prior art, and the light extraction efficiency needs to be improved.

Images