A method for running multiple batches continuously

Abstract

The invention provides a method for achieving multi-batch continuous operation. The method includes the steps that a track and a stepper which are arranged in an inline mode are controlled by an automatic equipment system to process multiple bathes of wafers which are continuously conveyed to the track; the transmission of batch ending signals is controlled by the automatic equipment system, manufacturing procedure requirements of a previous batch of wafers are compared with those of a later batch of wafers, the stepper is controlled not to carry out detection or reticle reset on the two batches of wafers respectively any more when it is determined that technological processes, adopted reticles and recipes of the two batches of wafers and the positions of processed film layers on the two batches of wafers are all consistent respectively, and then continuous processing on the two batches of wafers is achieved. Thus, the method can effectively save time, reduce production cost and improve machine utilization efficiency.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a multi-batch continuous operation method based on an equipment automation system. Background technique [0002] At present, for the production of semiconductor devices, an equipment automation system (hereinafter referred to as EAP system) is generally used to control the machine. For example, in the photolithography process, control the glue developing machine (track) and exposure machine (stepper or scanner) set inline. That is, when a cassette is placed in the glue developing machine, the EAP system will check the relevant process requirements with the manufacturing execution system (hereinafter referred to as the MES system), and then the following processes will be automatically performed in sequence: [0003] 1. The EAP system sends the start command to the glue developing machine; [0004] 2. The glue developing machine starts its processing work; [0005] 3. When the fir...

AI Technical Summary

Problems solved by technology

However, if the two batches of wafers that enter the exposure machine successively undergo the same process and use the same photomask, it is not necessary for the exposure machine to detect the two batches of wafers and select a new photomask necessary

In this way, not only a lot of time is spent on repeated inspections, which reduces production efficiency; moreover, each mask is not fully utilized, which increases production costs

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