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Complementary field effect transistor with double-work function metal gates and manufacturing method thereof

A complementary field effect and dual work function technology, which is applied in transistors, semiconductor/solid-state device manufacturing, semiconductor devices, etc., can solve problems such as the difficulty in manufacturing metal gates with double-band edge work functions

Active Publication Date: 2014-02-12
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the fabrication method of this double-edge work function metal gate is a difficult problem

Method used

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  • Complementary field effect transistor with double-work function metal gates and manufacturing method thereof
  • Complementary field effect transistor with double-work function metal gates and manufacturing method thereof
  • Complementary field effect transistor with double-work function metal gates and manufacturing method thereof

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Embodiment Construction

[0024] Embodiments of the present invention will be described below with reference to the drawings. Elements and features described in one drawing or one embodiment of the present invention may be combined with elements and features shown in one or more other drawings or embodiments. It should be noted that representation and description of components and processes that are not related to the present invention and known to those of ordinary skill in the art are omitted from the drawings and descriptions for the purpose of clarity.

[0025] A complementary field effect transistor (CMOS) with a dual work function metal gate and a manufacturing method thereof are described below according to an embodiment of the present invention. Transistors used in the formation of semiconductor devices are classified as NMOS or PMOS according to the type of main carriers migrating through their channel regions. Electrons are the main carriers in NMOS transistors, while holes are the main carr...

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Abstract

The invention relates to a manufacturing method of a complementary field effect transistor with double-work function metal gates. The complementary field effect transistor comprises a first transistor, a second transistor and an isolation structure used for isolating the first transistor and the second transistor. The manufacturing method is characterized by comprising the steps of depositing a gate dielectric layer on a substrate, depositing a first conducting material layer on the gate dielectric layer, forming a second conducting material layer at the position, corresponding to the first transistor, of the first conducting material layer, and forming a third conducting material layer at the position corresponding to the second transistor, wherein the second conducting material layer has a second work function lower than a third work function of the third conducting material layer. In addition, the invention further relates to the complementary field effect transistor with the double-work function metal gates. By means of the technical scheme, the double-work function metal gates can be obtained through the simple process, so that the large saturation current of a CMOS is obtained, and the threshold voltage is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductors, and more specifically relates to a complementary field effect transistor with a double work function metal gate and a manufacturing method thereof. Background technique [0002] The so-called work function refers to the responsiveness of all conductive materials in the semiconductor to the applied energy, which is usually expressed in electron volts (eV). The work function of a material usually refers to the minimum energy required to just move an electron from the interior of a solid to the surface. Different materials have different Fermi energies and electronic structures, so different amounts of energy need to be applied to remove an electron. [0003] Typically, conventional semiconductor materials have been selectively doped, resulting in N-type or P-type materials. N-type semiconductor materials have a Fermi level closer to the conduction band of silicon than to the valence band o...

Claims

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Application Information

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IPC IPC(8): H01L21/8238H01L21/283H01L27/092
CPCH01L21/823842H01L27/0922H01L29/4966
Inventor 韩锴王晓磊王文武杨红马雪丽
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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