Magnetic nano-multilayer film for magneto-dependent sensor and preparing method thereof
A magnetic sensor and magnetic nanotechnology, applied in the field of magnetic sensor, can solve the problems of the influence of the sensitivity of the magnetic sensor, and achieve the effects of improved sensitivity, low manufacturing cost, and simple processing technology
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[0082] see Image 6 , Image 6 It is a flow chart of the preparation method of the magnetic nano multilayer film of the present invention. The preparation method of the magnetic nano multilayer film for magnetic sensor of the present invention is used to prepare the magnetic nano multilayer film of the above-mentioned semi-open or closed ring structure, comprising the following steps:
[0083] Step S1, depositing and forming a magnetic nano-multilayer film comprising a substrate 1, a seed layer 2, a reference magnetic layer 3, an intermediate layer 4, a detection magnetic layer 5 and a cover layer 6 sequentially stacked from bottom to top;
[0084] Step S2, processing the bottom electrode 7 on the magnetic nano-multilayer film by photolithography;
[0085] Step S3, processing the required half-open or closed ring-shaped magnetic nano-multilayer film 9 on the bottom electrode 7;
[0086] Step S4, processing the top electrode 8 of the magnetic nano-multilayer film 9 by deposi...
Embodiment 1
[0108] A ring-shaped magnetic nano-multilayer film prepared by magnetron sputtering, with a structure of Si-SiO2 / Ta(5) / Ru(5) / Ta(5) / IrMn(15) / CoFe(2.5) / Ru(0.9) / CoFeB(3) / MgO(1) / CoFeB(10) / Ta(5) / Ru(5) (unit: nm). During deposition, a plane-induced magnetic field of 1000Oe is added, so the magnetization direction of the first magnetic layer is fixed by the antiferromagnetic pinning layer, and the magnetization direction of the second magnetic layer is free.
[0109] (1) Select a Si-SiO with a thickness of 1mm 2 The substrate is used as the substrate, and the seed layer 2 is deposited by magnetron sputtering, Ta(5nm) / Ru(5nm) / Ta(5nm), the deposition rate is 0.1nm / s, and the Ar gas sputtering pressure is 0.07 during deposition. Pa, the vacuum degree is better than 2×10 -6 Pa.
[0110] (2) Deposit 15nm thick IrMn as the antiferromagnetic pinning layer AFM by magnetron sputtering, the deposition rate is 0.1nm / s, the Ar gas sputtering pressure is 0.07Pa during deposition, and the vac...
Embodiment 2~6
[0121] Examples 2 to 6, except for those already marked, the remaining thickness units in the list are nanometers
[0122] Table 1
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