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Solder composition and printed wiring board using the same

A technology of composition and solder, which is applied in the direction of printed circuits, printed circuits, welding/cutting media/materials, etc. connected with non-printed electrical components, can solve problems such as easy edge collapse and rise in preheating temperature, and achieve suppression The effect of sagging and maintaining printability

Active Publication Date: 2016-11-09
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the lead-free solder powder in recent years, the preheating temperature tends to rise, so it is easy to cause sagging

Method used

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  • Solder composition and printed wiring board using the same
  • Solder composition and printed wiring board using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0051] Next, although an Example and a comparative example demonstrate this invention in more detail, this invention is not limited to these examples at all. In addition, the materials used in the Example and the comparative example are as follows.

[0052] Rosin-based resin: hydrogenated rosin, manufactured by Arakawa Chemical Industry Co., Ltd.

[0053] Solvent: Diethylene glycol monohexyl ether (DEH), manufactured by Nippon Emulsifier Co., Ltd.

[0054] Dispersion of amide-based condensate microparticles: referring to the following Production Example 1, the concentration of amide-based condensate microparticles in the dispersion is 20% by mass

[0055] Thixotropic agent A: fatty acid amide, trade name "SLIPACKS LA", manufactured by Nippon Chemicals Co., Ltd.

[0056] Thixotropic agent B: fatty acid amide, trade name "SLIPACKS H", manufactured by Nippon Chemicals Co., Ltd.

[0057] Thixotropic agent C: 12-hydroxystearic acid triglyceride, manufactured by Nippon Chemicals ...

manufacture example 1

[0064] 600.0 parts by mass of 12-hydroxystearic acid derived from hydrogenated castor oil fatty acid was added to a reaction device equipped with a stirrer, a thermometer, and a water separator, and heated to 80 to 100° C. to melt. Then, 116.0 parts by mass of hexamethylenediamine was added as a diamine, and condensation reaction was carried out while dehydrating for 5 to 8 hours at 170° C. under a nitrogen atmosphere to amidate it to obtain a product with an acid value of 4.2 and an amine value of 9.4. Low molecular weight diamide compound. Further add 68.0 parts by mass of a carboxyl group-containing polymer, which is a propylene-maleic anhydride copolymer with a weight average molecular weight of 10,000 and an acid value of 80 mg KOH / g, and condenses while dehydrating at 170° C. for 1 to 2 hours In the reaction, a part of the low-molecular-weight diamide compound is reacted with an unreacted amino group for amidation, and a high-molecular-weight diamide compound is produced...

Embodiment 1

[0067] 100 parts by mass of rosin resin, 51 parts by mass of solvent, 6.3 parts by mass of a dispersion of amide condensate particles, 1.8 parts by mass of activator A, 4.5 parts by mass of activator B, 1.2 parts by mass of Activator C and 0.4 parts by mass of an amine compound were mixed using a grinder to obtain a flux.

[0068] Then, 11% by mass of the obtained flux and 89% by mass of lead-free solder powder (100% by mass in total) were put into a container and mixed for 2 hours with a kneader to prepare a solder composition.

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Abstract

The present invention provides a solder composition comprising: rosin resin, amide condensate particles, solvent, activator, amine compound, and solder powder, wherein the amide condensate particles contain low molecular weight amide compounds and high-molecular-weight amide compound particles, the low-molecular-weight amide compound is obtained by combining aliphatic carboxylic acids with 2 to 22 carbon atoms including hydroxyaliphatic monobasic acids, and diamines and dimers with 2 to 16 carbon atoms. It is obtained by condensing any diamine in the amine, and the high molecular weight amide compound is obtained by condensing the above-mentioned aliphatic carboxylic acid, the above-mentioned diamine, and a carboxyl group-containing polymer with a weight average molecular weight of 2,000 to 100,000, and, relative to For 100 parts by mass of the rosin-based resin, the content of the amide-based condensate fine particles is not less than 1.1 parts by mass and not more than 2.7 parts by mass.

Description

technical field [0001] The present invention relates to a solder composition (so-called solder paste) for mounting components on a printed wiring board of an electronic device, and a printed wiring board obtained by mounting electronic components using the solder composition. Background technique [0002] Solder paste is a paste-like mixture obtained by kneading solder powder, rosin resin, activator, solvent, and the like. The solder paste is required to have printability and solderability, and is required to have the property of suppressing sag (the shape of the coating film of the solder paste collapses during preheating) during preheating in the reflow process (slump edge). However, if the viscosity and thixotropy of the solder paste are increased in order to improve the sag property of the solder paste, the printability of the solder paste tends to decrease. Therefore, printability and sagging are in an antinomy relationship, and it is difficult to have both properties...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363H05K1/18
CPCB23K35/262B23K35/264B23K35/3613B23K35/362B23K2101/42C08G73/10C08K5/09
Inventor 松村光弘堀尾遼介
Owner TAMURA KK