A multi-parameter collaborative control method suitable for flexible electronic label packaging process

Abstract

The invention discloses a multi-parameter cooperative control method suitable for the flexible electronic label encapsulation process. The method includes the steps of inputting technological parameter reference values of an antenna substrate and technological parameter reference values of a hot-pressing head, collecting and obtaining a current state parameter value, comparing a current operating temperature of the hot-pressing head with the temperature reference value of the hot-pressing head, outputting control signals and realizing closed-loop control over temperature, comparing a current state parameter of the substrate with the reference value of the substrate, comparing a current state parameter of the hot-pressing heat with the reference value of the hot-pressing head, regulating the tension and the position of the substrate together in a tension-position mixed control mode, and performing hot pressing and curing through the hot-pressing head so as to achieve the flexible electronic label encapsulation process. According to the method, the tension of the substrate, alignment of the substrate and the hot-pressing head and intercoupling influences among the tension of the substrate, alignment of the substrate and the hot-pressing head and the pressure of the hot-pressing head are considered comprehensively, closed-loop control over a plurality of technological parameters is achieved systematically, the encapsulation quality of electronic labels can be obviously improved correspondingly, and the method has the advantages of being suitable for various complex working conditions, not prone to being disturbed, high in efficiency, high in reliability and the like.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and more specifically relates to a multi-parameter cooperative control method suitable for the packaging process of flexible electronic tags. Background technique [0002] The Flip Chip packaging process commonly used in the production of flexible electronic tags includes substrate conveying, dispensing, mounting, hot pressing, and testing. On the pad; the placement head picks up the chip and places it on the pad of the antenna substrate; uses the thermal head to cure the conductive adhesive under pressure and heat at the same time, so as to realize the mechanical connection and electrical connection between the antenna and the substrate; detect the finished label Whether it meets the requirements for use, and mark the defective products. [0003] As we all know, the mechanical and electrical properties of the electronic label depend largely on the hot pressing process parameters...

AI Technical Summary

Problems solved by technology

For example, CN200810048371.1 discloses an intermittent flexible substrate tension control device, in which the control of the substrate tension is realized through the synchronous control of the angular displacement of the active feed motor and the driven take-up and discharge motor; however, due to the The shaft system forms a closed loop and is only coupled through the tension sensor, which cannot eliminate the change in the tension of the substrate caused by the asynchronous position of the material rollers caused by various disturbances

In addition, CN200710053106.8 discloses a multi-channel temperature controller, but this control method adopts a centralized control method, so it is impossible to realize the differential temperature control of multiple hot pressing heads, and it also does not affect the hot pressing process. Multiple parameters of the effect are considered comprehensively

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