Metallurgical compound technology for copper aluminum bimetal compound electronic framework strip

A composite process and frame plate technology, applied in metal processing equipment, metal rolling, metal rolling, etc., can solve the problems of inability to realize metallurgical bonding and low bonding strength of copper-aluminum composite interface

Inactive Publication Date: 2014-02-26
洛阳市伟创复合材料科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

solve
[0008] Solved the problem of low bonding strength of copper-aluminum composite interface and the inability to realize metallurgical bonding, and achieved improved copper-aluminum bimetallic composite

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] This embodiment is a metallurgical composite process of a single-layer composite copper-aluminum bimetallic composite electronic frame strip, and the specific steps are as follows:

[0032] Put the aluminum ingot into the smelting furnace for melting, and pour the completely melted molten aluminum into the static furnace for 13 minutes, then go through the online degassing and filtration, then flow into the launder and enter the composite area. At the same time, hot air is used to continuously blow and dehumidify the roll and electronic frame copper strip (brand: TPO / H65 / c19210 / c19400 / Lc7025), so that the temperature of the electronic frame copper strip and roll is controlled between 150-200 °C. The hot air is provided from the outside (it can be electric heating or other forms), and the air outlet is set on the movement track of the electronic frame copper strip and roll, so as to keep the electronic frame copper strip and roll dry in the composite area, so that the sur...

Embodiment 2

[0034] This embodiment is the metallurgical composite process of double-layer composite copper-aluminum bimetallic composite electronic frame strip, and the specific steps are as follows:

[0035] Put the aluminum ingot into the natural gas smelting furnace for melting, and pour the completely melted aluminum liquid into the standing furnace for standing

[0036] After 15 minutes, after online degassing and filtration, it flows into the launder and enters the composite area. At the same time, the hot air is used on the roller and the electronic

[0037] The frame copper strip (grade: TPO / H65 / c19210 / c19400 / Lc7025) is continuously blown and dehumidified to make the electronic frame

[0038] The temperature of the rack copper strip and roll is controlled between 150-200°C. The hot air is provided externally (it can be electric heating or

[0039] form), the air outlet is set on the trajectory of the copper strip and roll of the electronic frame, the purpose is to make the elec...

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Abstract

The invention discloses a metallurgical compound technology for a copper aluminum bimetal compound electronic framework strip. After an aluminum ingot is completely melted into molten aluminum, the molten aluminum flows into a compound region after standing by a standing furnace, online degassing and filtering, the electronic framework strip and the roller are continuously dehumidified by hot air in the compound region, the temperature of the roller and the electronic framework strip is kept at 150-200 DEG C in compounding, and the electronic framework strip and the molten aluminum are rolled by a cast-rolling mill to form the metallurgical compounded copper aluminum bimetal compound strip. During compounding, water vapor and oxidation of copper aluminum metal surfaces are avoided, water molecules are prevented from condensing on a copper aluminum compound interface and forming bubbles, and the post processing quality of the copper aluminum bimetal compound electronic framework strip is ensured. By adding 0.2-0.5% of aluminum titanium boron wires into the molten aluminum, copper aluminum metal molecules are metallurgically bonded. The problems of cracking, breaking, layering, falling-off and the like in post deep processing are thoroughly solved, the rate of finished products can reach more than 85-97%, and production cost is reduced. The metallurgical compound technology is widely applied to an electronic lead framework with the mark of TPO/H65/c19210/c19400/Lc7025.

Description

technical field [0001] The invention belongs to the technical field of production of copper-aluminum bimetallic composite strips, and specifically relates to a copper-aluminum bimetallic composite sheet [0002] The metallurgical composite process of frame plate and strip is widely used in electronic lead frames with grades TPO / H65 / c19210 / c19400 / Lc7025. technical background [0003] As the chip carrier of integrated circuits, the electronic lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. It plays the role of a bridge connecting with external wires. Most of the semiconductor integrated blocks need to use lead frames, which is an important basic material in the electronic information industry. [0004] With the rapid development of science and technology, different metal ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21B1/46B21B27/10B21B45/00B22D11/06B22D27/20
Inventor 郭红庆田凯
Owner 洛阳市伟创复合材料科技有限公司
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