A same-side material loading and blanking method and an automatic material loading and blanking mechanism for realizing the above method

Abstract

The invention discloses a same-side material loading and blanking method and an automatic material loading and blanking mechanism for realizing the above method. A rack, a material stacking mechanism and a blanking mechanism are comprised. A falling-off-type material loading mode is realized through the cooperation of a material distributing thimble and related mechanisms, and accordingly following beneficial effects are obtained: 1, the falling-off-type material loading mode is adopted, and material loading steps can be rapidly carried out; and intelligent automation can be realized, and processing materials can be conveyed continuously, so that the working efficiency of a machinery is raised; 2, through novel structures of a material feeding mechanism and the blanking mechanism, a function of same-side material loading and blanking can be realized, so that connection between the material loading and the blanking is more compact, and synchronization of the material loading and the blanking is realized; the efficiency and the automation degree are high; the same-side material loading can be realized, and a lot of machinery disposing space can be saved, so that the utilization rate of places is better improved; and 3, modes of material loading by manipulators are replaced, so that complex control of the manipulators is avoided. The same-side material loading and blanking method and the automatic material loading and blanking mechanism for realizing the above method are simple in structure, convenient to operate, and the same-side material loading and blanking method and the automatic material loading and blanking mechanism for realizing the above method substantially reduce costs.

Description

Technical field [0001] The present invention relates to the field of semiconductor packaging equipment, in particular to a method for loading and unloading on the same side and an automatic loading and unloading mechanism for realizing the above method. Background technique [0002] The die-bonding machine is an important equipment for the production of light-emitting diodes (LED). Its work flow is as follows: First, the feeding system transports the die-bonding holder in the storage device to the feeding channel, and then the die-bonding holder moves and moves along the feeding channel. Stay at a certain position. At this time, the glue dispensing module on the machine base automatically dispenses the bonding material, that is, the bonding material is glued to the bonding area of ​​the die bonding support, and then the chip is taken from the wafer tray by the automatic pick-and-place device. And the chip is bonded to the die attaching area of ​​the die die holder to complete the...

AI Technical Summary

Problems solved by technology

The existing die bonding machine mainly works with a single feeding channel, and the die bonding brackets can only be arranged one by one into the feeding channel for die bonding. This method is inefficient, takes a long time to bond the die, and because the feeding channel moves repeatedly in a straight line , so the accuracy of the placement of the die-bonding bracket is high, and a slight deviation or distortion of the die-bonding area on the die-bonding bracket will cause the situation that the die-bonding is not in place or cannot be bonded,

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