A method for loading and unloading on the same side and an automatic loading and unloading mechanism for realizing the method

Abstract

The invention discloses a same-side material loading and blanking method and an automatic material loading and blanking mechanism for realizing the above method. A rack, a material stacking mechanism and a blanking mechanism are comprised. A falling-off-type material loading mode is realized through the cooperation of a material distributing thimble and related mechanisms, and accordingly following beneficial effects are obtained: 1, the falling-off-type material loading mode is adopted, and material loading steps can be rapidly carried out; and intelligent automation can be realized, and processing materials can be conveyed continuously, so that the working efficiency of a machinery is raised; 2, through novel structures of a material feeding mechanism and the blanking mechanism, a function of same-side material loading and blanking can be realized, so that connection between the material loading and the blanking is more compact, and synchronization of the material loading and the blanking is realized; the efficiency and the automation degree are high; the same-side material loading can be realized, and a lot of machinery disposing space can be saved, so that the utilization rate of places is better improved; and 3, modes of material loading by manipulators are replaced, so that complex control of the manipulators is avoided. The same-side material loading and blanking method and the automatic material loading and blanking mechanism for realizing the above method are simple in structure, convenient to operate, and the same-side material loading and blanking method and the automatic material loading and blanking mechanism for realizing the above method substantially reduce costs.

Description

technical field [0001] The invention relates to the field of semiconductor packaging equipment, in particular to a same-side loading and unloading method and an automatic loading and unloading mechanism for realizing the method. Background technique [0002] Die bonding machine is an important equipment for the production of light-emitting diodes (LED). Its working process is as follows: firstly, the feeding system transports the die-bonding support in the storage device to the feeding channel, and then the die-bonding support moves along the feeding channel and Stay at a certain position, at this time, the dispensing module on the machine base automatically dispenses the adhesive material, that is, the adhesive material is placed on the die-bonding area of ​​the die-bonding bracket, and then the chip is taken from the wafer by the automatic pick-and-place device. And bonding the chip to the die-bonding area of ​​the die-bonding bracket, the die-bonding is completed. The ex...

AI Technical Summary

Problems solved by technology

The existing die bonding machine mainly works with a single feeding channel, and the die bonding brackets can only be arranged one by one into the feeding channel for die bonding. This method is inefficient, takes a long time to bond the die, and because the feeding channel moves repeatedly in a straight line , so the accuracy of the placement of the die-bonding bracket is high, and a slight deviation or distortion of the die-bonding area on the die-bonding bracket will cause the situation that the die-bonding is not in place or cannot be bonded, resulting in a high defect rate and an increase in cost

Or use a double-station feeding fixture to complete the alternate operation by manual feeding. The efficiency of manual feeding is low, the cycle of die bonding is relatively longer, and there are still certain human factors that cause product loss and increase costs.

Furthermore, in the prior art, a manipulator feeding method is also used. This method has a complicated mechanical structure, which causes an increase in the cost of the enterprise, and is also relatively cumbersome in operation.

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