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A kind of surface copper plating method of zirconium material

A zirconium material and copper plating technology, applied in the direction of cells, electrolysis process, electrolysis components, etc., can solve the problems of poor surface quality of zirconium material, large amount of copper, product surface grooves, etc., to achieve easy adhesion, strong coating adhesion, Plating smooth effect

Active Publication Date: 2016-03-30
西安西部新锆科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the preparation process of zirconium materials, thermal processing such as extrusion is generally performed. Due to the high surface activity of zirconium materials, oxides are easily formed at high temperatures, which will lead to waste of materials and increase the difficulty of subsequent processing, and The surface quality of the zirconium material is poor due to the friction between the zirconium material and the die during the extrusion process
At present, in the extrusion process of zirconium materials, the method of copper-clad sleeve is mainly adopted. Due to the gap between the copper sleeve and the billet, problems such as grooves on the surface of the product will occur due to asynchronous deformation during the extrusion process, and in The amount of copper used in the mass production process is also large
[0003] Therefore, in order to solve the problem of surface oxidation of zirconium material during thermal processing and waste of copper sheath during extrusion, copper plating can be performed on the surface of zirconium material, but zirconium is a kind of refractory metal, as a rare refractory metal The surface of the zirconium material is easy to form a stable passivation film, so that the coating and the substrate cannot be tightly combined
Therefore, it is difficult to form a dense and uniform coating on the surface of zirconium materials by conventional technology, and there is no relevant report on copper plating on the surface of zirconium materials.

Method used

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  • A kind of surface copper plating method of zirconium material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Copper plating on the surface of zirconium wire with a mass percentage of Zr not less than 95%:

[0021] Step 1. Wipe the zirconium material with alcohol to degrease, and then rinse it with water;

[0022] Step 2. Place the zirconium material rinsed in step 1 in the pickling solution for pickling, and then wash the pickled zirconium material with water to remove the residual pickling solution; the pickling solution is made of HF, HNO 3 and H 2 O is mixed according to the volume ratio of 5:40:55, in which HF and HNO 3 All are analytical reagents, the temperature of the pickling is 30°C, and the time is 40s;

[0023] Step 3, place the zirconium material that removes the residual pickling solution in step 2 into NH with a concentration of 20g / L 4 HF 2 Perform pre-film treatment in the solution; the temperature of the pre-film treatment is 30°C, and the time is 40s;

[0024] Step 4. Place the zirconium material after the pre-film treatment in step 3 in the electroplati...

Embodiment 2

[0027] Copper plating on the surface of the zirconium plate with the mass percentage of Zr not less than 95%:

[0028] Step 1. Wipe the zirconium material with alcohol to degrease, and then rinse it with water;

[0029] Step 2. Place the zirconium material rinsed in step 1 in the pickling solution for pickling, and then wash the pickled zirconium material with water to remove the residual pickling solution; the pickling solution is made of HF, HNO 3 and H 2 O is mixed according to the volume ratio of 10:50:40, in which HF and HNO 3 All are analytical reagents, the temperature of the pickling is 50°C, and the time is 20s;

[0030] Step 3, place the zirconium material that removes the residual pickling solution in step 2 into NH with a concentration of 30g / L 4 HF 2 Perform pre-film treatment in the solution; the temperature of the pre-film treatment is 50°C, and the time is 20s;

[0031] Step 4. Place the zirconium material after the pre-film treatment in step 3 in the elec...

Embodiment 3

[0034] Copper plating on the surface of the zirconium strip with the mass percentage of Zr not less than 95%:

[0035] Step 1. Wipe the zirconium material with alcohol to degrease, and then rinse it with water;

[0036] Step 2. Place the zirconium material rinsed in step 1 in the pickling solution for pickling, and then wash the pickled zirconium material with water to remove the residual pickling solution; the pickling solution is made of HF, HNO 3 and H 2 O is mixed according to the volume ratio of 8:42:50, in which HF and HNO 3 All are analytical reagents, the temperature of the pickling is 20°C, and the time is 80s;

[0037] Step 3, place the zirconium material that removes the residual pickling solution in step 2 into NH with a concentration of 10g / L 4 HF 2 Perform pre-film treatment in the solution; the temperature of the pre-film treatment is 20°C, and the time is 60s;

[0038] Step 4. Place the zirconium material after the pre-film treatment in step 3 in the elect...

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Abstract

The invention discloses a copper plating method on the surface of a zirconium material. The method comprises the following steps: 1. wiping the zirconium material with alcohol to degrease it, and then rinsing it with water; , and then wash the pickled zirconium material with water to remove residual acid; three, place the zirconium material that has removed residual acid in NH4HF2 solution for pre-film treatment; four, place the zircon material after pre-film treatment in electroplating solution for Copper electroplating, and then the zirconium material after electroplating copper plating is rinsed and dried. The invention can form a honeycomb structure on the surface of the zirconium material through the pre-film treatment, which overcomes the disadvantage that it is difficult to form a dense and uniform coating on the surface of the zirconium material. The coating is attached to the surface of the material, and the bonding force of the coating is stronger. The thickness of the coating can reach 0.05mm to 0.20mm. The coating is smooth, dense and not easy to fall off.

Description

technical field [0001] The invention belongs to the technical field of metal processing, and in particular relates to a copper plating method on the surface of a zirconium material. Background technique [0002] Zirconium is widely used in the nuclear industry and chemical industry because of its small neutron absorption cross-section and corrosion resistance. In the preparation process of zirconium materials, thermal processing such as extrusion is generally performed. Due to the high surface activity of zirconium materials, oxides are easily formed at high temperatures, which will lead to waste of materials and increase the difficulty of subsequent processing, and In the extrusion process, the surface quality of the zirconium material is poor due to the friction between the zirconium material and the mold. At present, in the extrusion process of zirconium materials, the method of copper-clad sleeve is mainly adopted. Due to the gap between the copper sleeve and the billet...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/38C25D21/12
Inventor 王旭峰田锋周军李中奎张建军王文生石明华贺爱锋梁国英陈鑫
Owner 西安西部新锆科技股份有限公司