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Transparent resin composition for injection molding encapsulation of light-emitting diode (LED)

A technology of transparent resin and injection molding, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., and can solve problems such as decreased adhesion, yellowing, and reduced luminous efficiency

Inactive Publication Date: 2014-03-12
BEIJING INSTITUTE OF PETROCHEMICAL TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a transparent resin composition for LED injection molding packaging, which has high heat resistance, yellowing resistance, and high transparency, and can solve the problem of epoxy resin molds for the existing chip-type LED packaging. Plastics are prone to yellowing, delamination, decreased adhesion, decreased mechanical properties, and decreased luminosity, etc.

Method used

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  • Transparent resin composition for injection molding encapsulation of light-emitting diode (LED)
  • Transparent resin composition for injection molding encapsulation of light-emitting diode (LED)
  • Transparent resin composition for injection molding encapsulation of light-emitting diode (LED)

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Embodiment 1～3

[0023] The formula and preparation technology of embodiment 1~3 are as shown in table 1, specifically as follows:

[0024] Table 1 Example 1-3 formula and preparation process (the amount of each raw material is calculated by mass percentage)

[0025]

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Abstract

The invention discloses a transparent resin composition for injection molding encapsulation of a light-emitting diode (LED), and belongs to the field of an LED encapsulation material. The composition is prepared from the following raw materials: 20-30wt% of triisocyanate epoxy resin, 10-20wt% of biphenyl epoxy resin, 20-40wt% of hydrogenated bisphenol A epoxy resin, 20-30wt% of curing agent, 0.1-1wt% of curing catalyst, 0.1-1wt% of antioxidant, 0.1-1wt% of silane coupling agent, 0.1-1wt% of chelating agent, 0.1-1wt% of release agent and 0.1-1wt% of rheology modifier in a mixing manner. The resin composition has the characteristics of being high in transparency, good in heat resistance and good in liquidity, and can well meet the requirements of an injection molding encapsulation technology of a patch LED.

Description

technical field [0001] The invention relates to the field of resin materials for LED encapsulation, in particular to a transparent resin composition for chip-type LED encapsulation used in an injection molding encapsulation process. Background technique [0002] At present, the development of LED is very rapid, and its application in display, lighting and other fields is increasing day by day. Traditional LED packaging mostly uses liquid epoxy resin, generally two components, A and B, and is packaged by potting process. Liquid epoxy resin is inconvenient to transport, use and store. Moreover, as the size of the LED decreases, the packaging form changes, and the packaging technology advances, the SMD packaging develops rapidly. [0003] At present, the packaging of SMD LEDs mostly adopts injection molding (transfer molding) packaging, and injection molding packaging requires the use of solid transparent epoxy resin molding compound. [0004] However, due to the long workin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08G59/42C08G59/20C08K13/02C08K5/544C08K5/5435H01L33/56
Inventor 杨明山程艳芳周颖胡晓东
Owner BEIJING INSTITUTE OF PETROCHEMICAL TECHNOLOGY
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