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Solid electrolytic capacitor and manufacturing method therefor

By forming a dielectric oxide film layer on the surface of the valve metal substrate of the solid electrolytic capacitor and controlling the impregnation time of the conductive polymer layer, the problem of uneven thickness of the conductive polymer layer is solved, and a thinner and dimensionally stable capacitor is realized. Suitable for thinning and size control when stacking multiple capacitors.

Active Publication Date: 2014-03-12
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the thickness dimension of the lower end portion of the capacitor element is not stable, and the thickness dimension of the lower end portion of the capacitor element varies greatly among batches of products. As a result, the dimensional variation of the solid electrolytic capacitor becomes larger.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach 》

[0049] A solid electrolytic capacitor has a capacitor element in which a valve action metal base having a dielectric oxide film layer formed on the surface of the anode body, a conductive polymer layer, and a cathode layer are respectively provided, and has an anode conducting member that conducts with the valve action metal base , and a cathode conducting member that is electrically connected to the cathode layer, at least the capacitor element is covered with an exterior resin. In addition, in order to obtain a predetermined capacitance, a plurality of capacitor elements are laminated and connected in parallel as necessary.

[0050] figure 1 (A), figure 1 (B), figure 1 (C), figure 1 (D) is a cross-sectional view of each stage of the manufacturing process of the solid electrolytic capacitor according to the first embodiment. Hereinafter, each step will be described with reference to these figures.

[0051] [Dielectric Oxide Film Layer Formation Process]

[0052] f...

no. 2 Embodiment approach 》

[0081] [Dielectric Oxide Film Layer Formation Process]

[0082] It is the same as the first embodiment.

[0083] [First conductive polymer layer formation process]

[0084] The valve action metal substrate with the dielectric oxide film layer 2 formed on the surface of the anode body 1 was immersed in a 32 wt% ethanol solution (monomer solution) of ethylenedioxythiophene for 60 seconds, then hung up and dried at room temperature After 5 minutes, 100.0 g of the dopant and 60.3 g of ammonium persulfate dissolved in 70.1 g of water were immersed in an oxidizing agent solution for 15 seconds, hung up, and left at room temperature for 15 minutes for drying and polymerization. . This Al foil was immersed in pure water for 5 minutes to wash, and dried in an oven at 105° C. for 10 minutes. Repeat the above monomer solution immersion and drying 8 times Oxidant solution impregnation and drying Washing and drying cycle.

[0085] Unlike the first embodiment, the immersion time in ...

no. 3 Embodiment approach 》

[0103] Figure 7 It is a plan view showing the position of the deposition part of the solid electrolytic capacitor of the third embodiment. in such as figure 2 , Figure 5 In the illustrated example, an example in which the upper deposition portion 3U and the lower deposition portion 3L are formed at positions at different distances from the lead-out electrode portion 7, which are wider in the lateral width direction, is not necessarily formed over the entire lateral width. widened in width, such as Figure 7 As shown in (A), it may be partially wider in the width direction and in the vertical direction. That is, it is not necessary to aim at the immersion conditions in which the precipitation part is immersed in the oxidizing agent solution so that the entire width of the precipitation part is wide. In addition, if Figure 7 As shown in (B), the upper precipitation part 3U and the lower precipitation part 3L are not necessarily bilaterally symmetrical (symmetrical about...

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Abstract

The invention provides a method for manufacturing a solid electrolyte capacitor with conductive polymer layer with little film thickness deviation. The method comprises: forming a first conductive polymer layer on a surface of a dielectric oxide film layer by immersing a valve-acting metal substrate alternately in a monomer solution and an oxidant solution, wherein immersion time in the oxidant solution falls within 15 seconds; and forming a second conductive polymer layer on a surface of the first conductive polymer layer by immersing the valve-acting metal substrate with the first conductive polymer layer in one of a soluble conductive polymer solution and a conductive polymer suspension. A cathode layer is formed on the conductive polymer layer.

Description

technical field [0001] The present invention relates to a solid electrolytic capacitor provided with a conductive polymer layer on a dielectric oxide film layer on the surface of a valve metal substrate and a method for manufacturing the same. Background technique [0002] Patent Document 1 discloses a method of manufacturing a solid electrolytic capacitor including a conductive polymer layer. [0003] Patent Document 1 discloses a solid electrolytic capacitor in which a dielectric oxide film is formed on the surface of a valve metal substrate (anode body), a first conductive polymer layer is formed on the surface of the dielectric oxide film by chemical polymerization, and further On the surface, a second conductive polymer layer using a soluble conductive polymer liquid is formed. [0004] [Patent Document 1] JP Unexamined Publication No. 2008-53512 [0005] In Patent Document 1, when forming the above-mentioned second conductive polymer layer, when the anode body on whi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G9/004H01G9/15
CPCH01G9/0036H01G9/028H01G11/48
Owner MURATA MFG CO LTD
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