High-frequency substrate structure and manufacturing method thereof

A substrate and high-frequency technology, applied in the field of high-frequency substrate structure and its manufacturing, can solve the problems of insufficient heat resistance and achieve the effects of good processability, good heat resistance, and low dielectric loss

Inactive Publication Date: 2014-03-12
KUSN APLUS TEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the low glass transition temperature Tg of the PTFE substrate is 19°C, and the heat resistance is insufficient

Method used

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  • High-frequency substrate structure and manufacturing method thereof
  • High-frequency substrate structure and manufacturing method thereof

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Embodiment

[0021] Example: Please refer to figure 1 , to show the high-frequency substrate structure 100 of the present invention, including: a first metal layer 110; a composite film 120, the composite film has a first sub-layer 121, a second sub-layer 122 and a third sub-layer 123; the second metal layer 130; the first metal layer 110 is formed on the first sub-layer 121 of the composite film 120, so that the first sub-layer 121 is sandwiched between the second sub-layer 122 and the first metal layer 110; the second The metal layer 130 is formed on the third sub-layer 123 such that the third sub-layer 123 is interposed between the second sub-layer 122 and the second metal layer 130 .

[0022] The second sub-layer 122 of the high-frequency substrate structure 100 of the present invention uses a fluorine-based polymer layer with a low dielectric constant material, examples of which include but are not limited to: polytetrafluoroethylene polyhexafluoropropylene copolymer, tetrafluoroethyl...

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Abstract

The invention disclose a high-frequency substrate structure and a manufacturing method thereof. The high-frequency substrate structure comprises a composite film that is formed by a first sublayer, a second sublayer and a third sublayer. The first sublayer, the second sublayer and the third sublayer are laminated in sequence; and at least one of the first sublayer, the second sublayer and the third sublayer is a fluorine type polymer layer. In addition, the high-frequency substrate structure also includes a first metal layer and a second metal layer. The first metal layer is formed at the first sublayer that is clamped between the second sublayer and the first metal layer; and the second metal layer is formed at the third sublayer that is clamped between the second sublayer and the second metal layer. According to the invention, the manufacturing process machinability of the high-frequency substrate structure is good; and on the basis of testing results, the high-frequency substrate structure has the advantages of low dielectric constant, low dielectric loss and good heat resistance.

Description

technical field [0001] The invention relates to a high-frequency substrate structure, in particular to a high-frequency substrate structure in which a composite film is sandwiched between two metal layers and a manufacturing method thereof. Background technique [0002] Printed circuit boards are an indispensable material in electronic products, and with the growing demand for consumer electronics, the demand for printed circuit boards is also increasing day by day. Due to the characteristics of flexibility and three-dimensional wiring, flexible printed circuit boards are currently widely used in computers and their peripheral equipment, Communication products and consumer electronics products, etc. [0003] Recently, due to the trend of high-speed and high-frequency application of electronic products, today's electronic products need to be supported by printed circuit boards for high-frequency circuits to achieve high-frequency and high-speed operation. Among the many mat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K3/46
Inventor 林志铭洪金贤林惠峰李建辉
Owner KUSN APLUS TEC CORP
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