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Method for preparing piezoelectric bimorph

A piezoelectric bimorph, piezoelectric body technology, applied in piezoelectric/electrostrictive/magnetostrictive devices, circuits, electrical components, etc., can solve problems such as device failure, bonding defects, bimorph failure, etc. Reliable work and long life effect

Active Publication Date: 2014-03-19
CHONGQING ZHONGLEI SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the bonding process, the intermediate support sheet and the epoxy resin adhesive layer are made of different materials, and the adhesive layer and the intermediate support sheet are prone to delamination, cracking or falling off, resulting in failure of the double chip
Although domestic and foreign R&D personnel perform activation treatment on the surface of the intermediate support to enhance the bonding force with the epoxy resin, the treatment effect is prone to deviations, and it is very easy to have bonding defects, resulting in device failure.

Method used

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  • Method for preparing piezoelectric bimorph
  • Method for preparing piezoelectric bimorph
  • Method for preparing piezoelectric bimorph

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] In this embodiment, the upper and lower piezoelectric bodies and the fiberboard prepreg adopt a rectangular structure, the electrode layer of the upper and lower piezoelectric bodies adopts gold electrodes, and the fiberboard prepreg is a unidirectional glass fiber prepreg, and the fiber bundle distribution is shown in image 3 ; The uncured prepreg resin in the fiberboard prepreg is epoxy resin, and the upper and lower piezoelectric bodies have the same size and the same material.

[0030] The piezoelectric bimorph preparation method in the present embodiment comprises the following steps:

[0031] Step 1: Wash the lower piezoelectric body 1 with electrodes and the upper piezoelectric body 2 with electrodes with water, alcohol and acetone, and dry them at 120°C for use;

[0032] Step 2: Cut the uncured fiberboard prepreg 3 into the required size for use;

[0033] Step 3: The lower piezoelectric body 1 with electrodes, the upper piezoelectric body 2 with el...

Embodiment 2

[0038] In this embodiment, the upper and lower piezoelectric body and the fiberboard prepreg adopt a rectangular structure, the electrode layer of the upper and lower piezoelectric body adopts silver electrodes, and the fiberboard prepreg is an ordinary two-way glass fiber prepreg, and the fiber bundle distribution is shown in Figure 4 ; The uncured prepreg resin in the fiberboard prepreg is epoxy resin, and the upper and lower piezoelectric bodies have the same size and the same material.

[0039] The piezoelectric bimorph preparation method in the present embodiment comprises the following steps:

[0040] Step 1: Wash the lower piezoelectric body 1 with electrodes and the upper piezoelectric body 2 with electrodes with water, alcohol and acetone, and dry them at 120°C for use;

[0041] Step 2: Cut the uncured fiberboard prepreg 3 into the required size for use;

[0042] Step 3: The lower piezoelectric body 1 with electrodes, the upper piezoelectric body 2 with ...

Embodiment 3

[0047] In this embodiment, the upper and lower piezoelectric body and the fiberboard prepreg adopt a rectangular structure, the electrode layer of the upper and lower piezoelectric body adopts silver-palladium electrodes, the fiberboard prepreg is a unidirectional carbon fiber prepreg, and the distribution of fiber bundles is the same as in Example 1. ; The uncured prepreg resin in the fiberboard prepreg is epoxy resin; the upper and lower piezoelectric bodies have the same size and the same material.

[0048] The piezoelectric bimorph preparation method in the present embodiment comprises the following steps:

[0049] Step 1: Wash the lower piezoelectric body 1 with electrodes and the upper piezoelectric body 2 with electrodes with water, alcohol and acetone, and dry them at 120°C for use;

[0050] Step 2: Cut the uncured fiberboard prepreg 3 into the required size for use;

[0051] Step 3: The lower piezoelectric body 1 with electrodes, the upper piezoelectric b...

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Abstract

The invention relates to a method for preparing a piezoelectric bimorph. Non-solidified epoxy resin contained by a fiberboard prepreg is enabled to be melted, scattered and solidified under the action of high-temperature directional pressure, thereby realizing bonding between an intermediate supporting piece and a piezoelectric body. Solidification and moulding are carried out while the piezoelectric body and the intermediate supporting piece are realized. The acquired piezoelectric bimorph has the characteristics of reliable operation and long service life.

Description

technical field [0001] The invention belongs to the technical field of piezoelectric ceramic drivers and sensors, in particular to a method for preparing piezoelectric bimorphs. Background technique [0002] With the development of electronic technology, the bimorph type piezoelectric driver or sensor formed by using the direct piezoelectric effect or inverse piezoelectric effect of piezoelectric technology can be used as the core control element of intelligent control. Piezoelectric pumps for conveying gas and liquid mostly use simply supported beam bimorphs, which use the inverse piezoelectric effect of the piezoelectric chip to drive the flexural vibration of the entire piezoelectric drive vibrator to change the volume formed between the piezoelectric drive vibrator and the housing. The volume of the chamber realizes continuous negative pressure suction and pressurized discharge of gas and liquid. The piezoelectric valve also uses a cantilever beam bimorph. Under the act...

Claims

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Application Information

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IPC IPC(8): H01L41/293
Inventor 王素贞
Owner CHONGQING ZHONGLEI SCI & TECH
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