PA10T polyamide resin and polyamide composition composed of same

A technology of polyamide composition and polyamide resin, applied in the field of polyamide composition, can solve the problems of resin degradation, limited application and the like, and achieve the effect of high fluidity

Active Publication Date: 2014-03-26
KINGFA SCI & TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned operation methods inevitably bring about the problem of resin

Method used

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  • PA10T polyamide resin and polyamide composition composed of same
  • PA10T polyamide resin and polyamide composition composed of same
  • PA10T polyamide resin and polyamide composition composed of same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~11

[0044] Embodiment 1~11 and comparative example 1~4

[0045] In the autoclave equipped with magnetic coupling stirring, condenser, gas phase port, feeding port, and pressure explosion-proof port, add the reaction raw materials according to the ratio in Table 1, then add sodium hypophosphite and deionized water; the weight of sodium hypophosphite is deionized 0.1% of the weight of other feeds except water, and 30% of the total weight of deionized water; vacuumize and fill high-purity nitrogen as a protective gas, and heat up to 220 within 2 hours under stirring o C, the reaction mixture was heated at 220 o C was stirred for 1 hour, and then the temperature of the reactant was raised to 230 o C; response at 230 o The constant temperature of C and the constant pressure of 2.2Mpa continued for 2 hours, and the pressure was kept constant by removing the formed water. After the reaction was completed, the prepolymer was discharged at 80 o C under vacuum drying 24 hours, obtain pr...

Embodiment 12~16 and comparative example 5~8

[0051] Mix PA10T polyamide resin, titanium dioxide, talcum powder, and other additives uniformly in the high-mixer according to the formula in Table 3, and then feed them into the twin-screw extruder through the main feeding port, and the reinforcing filler passes through the side feeding scale. Feed, extrude, water-cooled, granulate and dry to obtain the polyamide composition; wherein, the extrusion temperature is 330 o c.

[0052] table 3

[0053]

[0054] By comparison of Examples 1 to 11 and Comparative Examples 1 to 4, it can be seen that with the increase of the amount of multifunctional compound added, the relative viscosity of the polyamide 10T resin decreases first and then increases; when the added amount of multifunctional compound is 0 When the relative viscosity is higher, the PA10T polyamide resin (comparative example 1) is obtained; when the addition amount of the multifunctional compound exceeds 1mol%, the relative viscosity of the higher PA10T polyamide re...

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Abstract

The invention discloses a PA10T polyamide resin. The relative viscosity of the PA10T polyamide resin in 98% concentrated sulfuric acid of 25 DEG C is 1.1-1.8; the terminal amino value of the PA10T polyamide resin is 20-60 mol/t, and the terminal carboxyl value is 70-130 mol/t; in the PA10T polyamide resin, benzoic acid accounts for 2-6 mol% of repetitive units; and the PA10T polyamide resin is prepared by adding polyfunctional compounds in a polymerization process and performing polymerization, wherein the amount of the polyfunctional compounds is 0.1-1 mol%. The invention also discloses a polyamide composition which comprises the following components in percentage by weight: 40-99wt% of PA10T polyamide resin, 0.8-89wt% of mineral filler and 0.2-1wt% of other assistants. The PA10T polyamide resin disclosed by the invention has low apparent viscosity in the melt condition and has high flowability; and the polyamide composition composed of the PA10T polyamide resin has high flowability and basically equivalent mechanical property, and can be used for occasions having high requirements for the dimensions of injection molding products.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a PA10T polyamide resin and a polyamide composition composed of it. Background technique [0002] Polyamide is widely used because of its good comprehensive properties, including mechanical properties, heat resistance, wear resistance, chemical resistance and self-lubrication, low coefficient of friction, certain flame retardancy, and easy processing. It is suitable for filling and modifying with glass fiber and other fillers to improve performance and expand application range. In recent years, semi-aromatic polyamides have been focused on development due to their better heat resistance and mechanical properties. [0003] Poly(decanediamine terephthalamide) PA10T polyamide resin, which is polymerized from decylenediamine and terephthalic acid, has low water absorption and high melting point, and is currently developing rapidly. However, compared to PA6T polyamide resin, the mel...

Claims

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Application Information

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IPC IPC(8): C08G69/26C08L77/06C08K13/02C08K3/22C08K3/34
Inventor 张传辉蔡彤旻袁绍彦曾祥斌曹民吉继亮夏世勇
Owner KINGFA SCI & TECH CO LTD
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