A method for making a three-dimensional flexible stack package structure with embedded ultra-thin chips
A three-dimensional flexible, ultra-thin chip technology, used in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., to solve the problem of holding and alignment
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[0057] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.
[0058] Such as figure 1 as shown, figure 1 It is a flowchart of a method for manufacturing a three-dimensional flexible package-on-package structure according to an embodiment of the present invention, and the method includes the following steps:
[0059] Step 1: Select a flexible substrate with a single-layer metal layer, etch the single-layer metal layer on the flexible substrate to form multiple metal electrodes, and perform laser grooving on the side of the flexible substrate without a single-layer metal layer to form multiple electrodes. grooves; wherein, the size of the plurality of grooves is consistent with the size of a plurality of metal electrodes formed by etching the single-layer metal layer on the flexible ...
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