A method for making a three-dimensional flexible stack package structure with embedded ultra-thin chips

A three-dimensional flexible, ultra-thin chip technology, used in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., to solve the problem of holding and alignment

Active Publication Date: 2016-06-01
NAT CENT FOR ADVANCED PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, this three-dimensional flexible packaging method does not need to hold the thin chip, which effectively solves the problem of holding and aligning the thin chip

Method used

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  • A method for making a three-dimensional flexible stack package structure with embedded ultra-thin chips
  • A method for making a three-dimensional flexible stack package structure with embedded ultra-thin chips
  • A method for making a three-dimensional flexible stack package structure with embedded ultra-thin chips

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Embodiment Construction

[0057] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0058] Such as figure 1 as shown, figure 1 It is a flowchart of a method for manufacturing a three-dimensional flexible package-on-package structure according to an embodiment of the present invention, and the method includes the following steps:

[0059] Step 1: Select a flexible substrate with a single-layer metal layer, etch the single-layer metal layer on the flexible substrate to form multiple metal electrodes, and perform laser grooving on the side of the flexible substrate without a single-layer metal layer to form multiple electrodes. grooves; wherein, the size of the plurality of grooves is consistent with the size of a plurality of metal electrodes formed by etching the single-layer metal layer on the flexible ...

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Abstract

The invention discloses a method for manufacturing a three-dimensional flexible stack package structure of an embedded ultra-thin chip, comprising: selecting a flexible substrate with a single-layer metal layer, etching the single-layer metal layer on the flexible substrate to form multiple Metal electrodes, and laser grooves are formed on the side of the flexible substrate without a single metal layer to form multiple grooves; flip-chip thermocompression bonding of multiple chips on the side of the flexible substrate with multiple grooves; thermocompression bonding of the flexible substrate The side with multiple chips is hot-pressed with a flexible medium layer, so that the multiple chips are embedded in the flexible medium layer; the side of the flexible medium layer with multiple chips embedded in the flexible substrate is thinned to obtain a reduced thickness. A thin flexible dielectric module embedded with multiple chips; bending the part of the flexible dielectric module without chips to realize the stacking of multiple chips; potting and curing the three-dimensional flexible packaging module stacked with multiple chips; and The three-dimensional flexible packaging module after potting is wired or ball-planted.

Description

technical field [0001] The invention relates to the technical field of system packaging in the microelectronics industry, in particular to a method for manufacturing a three-dimensional flexible stack packaging structure for embedded ultra-thin chips. Background technique [0002] Modern portable electronic products put forward higher requirements for microelectronic packaging. With the continuous pursuit of lighter, thinner, smaller, high reliability and low power consumption, microelectronic packaging is also moving towards higher density and smaller size. Development of smaller packages. In recent years, three-dimensional packaging technology has attracted widespread attention from all over the world. Developed countries such as the United States, European countries, and Japan have invested heavily in related research and development, and have achieved considerable research results. [0003] Three-dimensional packaging technology refers to the three-dimensional high-dens...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/768H01L21/60
CPCH01L25/50H01L21/56H01L2224/32145H01L2224/73253
Inventor 张霞于大全张博
Owner NAT CENT FOR ADVANCED PACKAGING
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