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Silver alloy wire for bonding applications

A technology for bonding wires and leads, used in welding equipment, metal processing, welding media, etc.

Active Publication Date: 2014-03-26
赫劳斯材料工艺有限及两合公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although silver wires provide very good electrical and thermal conductivity, bonding of silver wires has its challenges

Method used

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  • Silver alloy wire for bonding applications
  • Silver alloy wire for bonding applications
  • Silver alloy wire for bonding applications

Examples

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example

[0072] The invention is further illustrated by examples. This example serves to illustrate the invention and is not intended to limit the scope of the invention or the claims in any way.

[0073] Alloys were prepared by melting predetermined amounts of pure silver and adding predetermined amounts of pure gold and palladium to obtain a well mixed composition as follows (in weight-%):

[0074] silver gold palladium

[0075] 89% 8% 3%

[0076] The molten mixture was cast and cooled to obtain a lead core precursor. The lead precursor had a diameter of 2 mm.

[0077] The 2 mm diameter lead core precursor was then annealed in an intermediate annealing step. In this step, the core precursor is inserted into an annealing furnace preheated to a temperature of 500°C. Then, the core precursor was kept in the furnace at a constant temperature of 500° C. for an exposure time of 90 minutes.

[0078] This intermediate annealing step was followed by a cooling step with the following par...

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Abstract

The invention refers to a silver alloy wire for bonding applications. The invention is related to a bonding wire, comprising: a core with a surface, wherein the core comprises silver as a main component and at least one member selected from the group consisting of gold, palladium, platinum, rhodium, ruthenium, nickel, copper and iridium, characterized in that the bonding wire has at least one of the following properties: i) an average size of crystal grains of the core is between 0.8 [mu]m and 3 [mu]m, ii) the amount of crystal grains having an orientation in <001> direction in the cross section of the wire is in the range of 10-20 %, iii) the amount of crystal grains having an orientation in <111> direction in the cross section of the wire is in the range of 5-15 %, and iv) the total amount of crystal grains having an orientation in <001> direction and of crystal grains having an orientation in <111> direction in the cross section of the wire is in the range of 15-40 %.

Description

technical field [0001] The present invention relates to a bonding wire comprising: a core having a surface, wherein the core contains silver as a main component and contains a metal selected from the group consisting of gold, palladium, platinum, rhodium, ruthenium, nickel, copper and iridium. at least one. [0002] The invention also relates to a microelectronic component package having a lead according to the invention and a method for producing a lead according to the invention. Background technique [0003] Bonding wires are used during semiconductor device fabrication to electrically interconnect integrated circuits to printed circuit boards. Furthermore, bond wires are used in power electronics applications to electrically connect transistors, diodes, etc. to pads or pins of a housing. Although initially the bonding wires were made of gold, less expensive materials such as silver are used today. Although silver wires provide very good electrical and thermal conducti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/48C22C5/06
CPCB23K35/3006B23K2201/42H01L24/45H01L2224/43H01L2224/45139H05K7/02H01L24/43H01L2924/01047C22C5/06B23K2201/36H01L2924/01006H01L2924/00014B23K2201/40B23K35/0227H01L2924/12041H01L2224/43848H01L2224/45015H01L2924/00011B23K2101/36B23K2101/40B23K2101/42H01L2924/00H01L2224/48H01L2924/01079H01L2924/01046H01L2924/01078H01L2924/01045H01L2924/01044H01L2924/01028H01L2924/01029H01L2924/01077H01L2924/013H01L2924/20109H01L2924/2011H01L2924/01049H01L2924/20111H01L2924/01004H01L2924/01005
Inventor J-S·柳E-K·郑Y-D·卓
Owner 赫劳斯材料工艺有限及两合公司
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