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Flexible Copper Clad Laminates

A technology of copper clad laminate and copper clad layer, applied in the direction of layered products, metal layered products, circuit substrate materials, etc., can solve the problem of difficult to meet the requirements of high density, and achieve the effect of high bending resistance

Active Publication Date: 2017-12-12
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is difficult to meet the demand for further high density only by the above-mentioned conventional technology

Method used

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  • Flexible Copper Clad Laminates
  • Flexible Copper Clad Laminates
  • Flexible Copper Clad Laminates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0071] Hereinafter, the present invention will be described in more detail based on examples. In addition, each characteristic evaluation in the following Examples was performed by the following method.

[0072] [Measurement of tensile modulus of elasticity]

[0073] Using STROGRAPH R-1 manufactured by Toyo Seiki Co., Ltd., the value of the tensile modulus was measured in an environment with a temperature of 23° C. and a relative humidity of 50%.

[0074] [Measurement of Coefficient of Thermal Expansion (CTE)]

[0075] Using a thermomechanical analyzer manufactured by Seiko Instruments, the temperature was raised to 250°C, and after being kept at this temperature for 10 minutes, the average thermal expansion coefficient (linear thermal expansion coefficient) from 240°C to 100°C was obtained by cooling at a rate of 5°C / min. ).

[0076] [Measurement of surface roughness (Rz)]

[0077] The surface roughness of the contact surface side with the polyimide layer of copper foil w...

Synthetic example 1

[0085] Add N,N-dimethylacetamide to a reaction vessel equipped with a thermocouple and a stirrer and capable of introducing nitrogen, while putting 2,2-bis[4-(4-aminophenoxy)phenyl into the reaction vessel ] Propane (BAPP) and stir in a container while allowing it to dissolve. Next, pyromellitic dianhydride (PMDA) was charged so that the total amount of monomers charged was 12 wt %. Thereafter, stirring was continued for 3 hours to perform a polymerization reaction, and a resin solution of polyamic acid a was obtained.

[0086] The coefficient of thermal expansion (CTE) of a polyimide film with a thickness of 25 μm formed from polyamic acid a is 55 × 10 -6 / K.

Synthetic example 2

[0088]Add N,N-dimethylacetamide to a reaction vessel equipped with a thermocouple and a stirrer and capable of introducing nitrogen, and put 2,2'-dimethyl-4,4'-diaminobiphenyl into the reaction vessel (m-TB) and stir in the container to dissolve. Next, add 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) and pyromellitic dianhydride (PMDA), and make the total amount of monomer input be 15wt%, and the molar ratio of each anhydride (BPDA:PMDA) is 20:80. Thereafter, stirring was continued for 3 hours to perform a polymerization reaction, and a resin solution of polyamic acid b was obtained.

[0089] The coefficient of thermal expansion (CTE) of a polyimide film with a thickness of 25 μm formed from polyamic acid b is 22 × 10 -6 / K.

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Abstract

The present invention provides a flexible copper-clad laminate having a folding resistance property, capable of preventing a wire circuit from being disconnected or cracked in a narrow housing. The flexible copper-clad laminate according to the present invention is a flexible copper-clad laminate, in which a copper plate (B) having a thickness of 8-20 μm, a tensile modulus of 10-20 Gpa, and having an average crystalline particle diameter of at least 10 μm in a section taken in a thickness direction is provided at least one surface of a polyimide layer (A) having a thickness of 10-25 μm and a tensile modulus of 4-10 Gpa, folded and received in a housing of an electronic device. A folding coefficient calculated through following Equation (I) is in the range of 0.96±0.02 in a bending test in which a gap of a predetermined flexible substrate having a copper wire formed by machining the copper plate of the flexible copper-clad laminate is 0.3 mm. Equation 1 is expressed as [PF]=(¦ε¦-ε_c) / ¦ε¦ , wherein ¦ε¦ is an absolute value of an average distortion value of the bent copper wire, and ε_c represents the distortion of the tensile elastic limit of the copper wire.

Description

technical field [0001] The present invention relates to a flexible copper-clad laminate used in a flexible circuit board folded and accommodated in a case of an electronic device. Background technique [0002] In recent years, electronic devices represented by mobile phones, notebook computers, digital cameras, and game consoles have rapidly developed in terms of miniaturization, thinning, and lightening. For these materials, even in a small space, the High-density and high-performance materials for parts storage are expected. For flexible circuit boards, along with the popularization of high-performance small electronic devices such as smartphones, there is progress in increasing the density of component storage. Therefore, it is necessary to house flexible circuit boards in narrower boxes than ever before. Therefore, also in the flexible copper-clad laminate which is the material of the flexible circuit board, it is required to improve the bending resistance from the aspe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/03
CPCB32B7/022B32B15/08B32B27/281B32B2307/54B32B2457/08H05K1/056
Inventor 矢熊建太郎金子和明及川真二藤元伸悦
Owner NIPPON STEEL CHEM &MATERIAL CO LTD
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