Vertical oxidizing furnace process door cooling method and device used in wet oxidation process

A cooling method and oxidation furnace technology, applied in vertical furnaces, furnaces, furnace components, etc., can solve the problems of high reprocessing cost, can not be changed at will, affect production capacity, etc., achieve good maintenance, increase costs, and avoid water droplets Effect

Active Publication Date: 2014-04-16
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] The disadvantages of the above two methods are: to change the heat capacity of the heat preservation barrel, hardware modification is required. The heat preservation barrel is made of quartz material. Generally, the heat preservation barrel has an integrated structure

Method used

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  • Vertical oxidizing furnace process door cooling method and device used in wet oxidation process
  • Vertical oxidizing furnace process door cooling method and device used in wet oxidation process
  • Vertical oxidizing furnace process door cooling method and device used in wet oxidation process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] First of all, the equipment structure of a semiconductor vertical oxidation furnace used in the present invention is introduced.

[0040] In this example, see figure 1 and figure 2 , figure 1 It is a structural schematic diagram of the carrier and sealing mechanism in a semiconductor vertical oxidation furnace; figure 2 yes figure 1 The top view of the process door sealing mechanism in .

[0041] Such as figure 1 As shown, in the process, in order to ensure a good thermal field, a thermal insulation barrel 4 is installed on the top of the process door. The function of the insulation barrel is to prevent the heat loss inside the furnace body, and to prevent the high temperature radiation from damaging the process door and nearby components. A quartz boat 6 is installed on the top of the heat preservation bucket, which is used to carry a process chip (silicon chip) 5 .

[0042] Simultaneously, in order to realize the tightness of process door better, on process doo...

Embodiment 2

[0065] In the present embodiment, the method and device in the first embodiment are used to set and control the relevant process parameters as follows:

[0066] (1) The wet oxygen process temperature is 700-800°C;

[0067] (2) The main process is: 700°C wet oxygen process for 30-60 minutes, H2:O2=6SLM:4.5SLM; 700°C to 800°C wet oxygen process for 20-30min, H2:O2=6SLM:4.5SLM; 800°C wet oxygen process for 60-120min, H2:O2=6SLM:4.5SLM; N2 purge at 800°C for 30-60min, N2 flow rate is 10SLM;

[0068] (3) The circulating cooling water flow rate of the process door and the bottom of the furnace body is 1-2L / min.

[0069] In the process, if the temperature detected by the thermocouple on the process door and the bottom of the furnace body exceeds the temperature limit temperature of the sealing part of the process door, and the flow rate of circulating cooling water has reached the upper limit of the set flow rate in the corresponding wet oxygen process temperature range, press its ...

Embodiment 3

[0073] In the present embodiment, the method and device in the first embodiment are used to set and control the relevant process parameters as follows:

[0074] (1) The wet oxygen process temperature is 400-500°C;

[0075] (2) The main process is: 400°C wet oxygen process for 30-60min, H2:O2=6SLM:4.5SLM; 400°C to 500°C wet oxygen process for 20-30min, H2:O2=6SLM:4.5SLM; 500°C wet oxygen process for 60-120min, H2:O2=6SLM:4.5SLM; N2 purge for 30-60min at 500°C, N2 flow rate is 10SLM;

[0076] (3) The circulating cooling water flow rate of the process door and the bottom of the furnace body is 0.1-1L / min;

[0077] In the process, if the temperature detected by the thermocouple on the process door and the bottom of the furnace body exceeds the temperature limit temperature of the sealing part of the process door, and the flow rate of circulating cooling water has reached the upper limit of the set flow rate in the corresponding wet oxygen process temperature range, press its 2~3...

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Abstract

The invention discloses a vertical oxidizing furnace process door cooling method and device used in a wet oxidation process. According to the method and device, the wet oxidation process is divided into a high temperature interval, a middle temperature interval and a low temperature interval based on the requirement of a wet oxidation process result according to different main process temperatures, a control module of the device is used for setting process doors with different flow ranges from large to small and the circulating cooling water flow of the bottom of a furnace body according to the three different temperature intervals, the flows of circulating cooling water pipelines of the process doors are adjusted through a flow controller according to a detected temperature value of a thermocouple in the process, so that the process result is guaranteed, and sealing parts of the process doors are not damaged. The method and device are simple in operation, cost is not increased, and equipment is well maintained.

Description

technical field [0001] The present invention relates to a cooling method and a cooling device for a process door of a semiconductor vertical oxidation furnace, more specifically, to a cooling method and corresponding cooling water flow differential control for the process door of a vertical oxidation furnace in a wet oxygen process cooling control device. Background technique [0002] The gas transmission system of the semiconductor vertical oxidation furnace adopts the gas supply and discharge mode of upper air intake and lower exhaust. Wherein, the exhaust pipeline is located at the lower part of the furnace tube, close to the process door. [0003] see figure 1 and figure 2 , figure 1 It is a structural schematic diagram of the carrier and sealing mechanism in a semiconductor vertical oxidation furnace; figure 2 yes figure 1 The top view of the process door sealing mechanism in . Such as figure 1 As shown, in the process, in order to ensure a good thermal field,...

Claims

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Application Information

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IPC IPC(8): F27B1/24F27B1/26F27B1/28F27D1/18
Inventor 林伟华宋辰龙兰天王兵
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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