Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

MEMS (Micro-Electromechanical System)-based micro-mechanical sensor

A technology of micromechanical sensors and substrates, applied in the direction of material resistance, can solve the problems of incompatibility of microelectronics in the production process, difficulty in large-scale use, measurement influence, etc., and achieve easy control of process quality, improved efficiency, and reduced volume. Effect

Inactive Publication Date: 2014-04-23
NANJING UNIV OF INFORMATION SCI & TECH
View PDF5 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this raindrop spectrometer is expensive, difficult to use on a large scale, and its production process is not compatible with microelectronics processes
Instruments based on optical principles are also easily affected by the surrounding environment, such as dust blocking the lens, which will affect the measurement

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • MEMS (Micro-Electromechanical System)-based micro-mechanical sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] Below in conjunction with accompanying drawing, the technical scheme of invention is described in detail:

[0022] like figure 1 The shown micromechanical sensor with three substrates includes: a first substrate 101, a second substrate 201, and a third substrate 301 made of a single crystal silicon wafer, the third substrate 301 is a base, and the second substrate 201 is placed on the second substrate. The third substrate 301 is above and connected to the third substrate 301 , and the first substrate 101 is placed above the second substrate 201 and connected to the second substrate 201 .

[0023] The first substrate 101 is processed by the MEMS process to obtain a first cavity 103 with an opening downward, and the first diaphragm 102 attached to the surface of the first substrate 101 and the first cavity 103 enclose the composite cavity. When the first diaphragm 102 is damaged by a strong impact, the first diaphragm 102 can be replaced, which is convenient to use and i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an MEMS (Micro-Electromechanical System)-based micro-mechanical sensor, belonging to the technical field of micro-mechanical sensors. The sensor comprises three layers of substrates made from monocrystalline silicon wafers, and a unique path for gas circulation is formed by a first cavity formed in a first substrate, a first through hole formed in a second substrate and a third cavity formed in a third substrate. When a first diaphragm stuck to the first substrate is damaged due to strong impact, the first diaphragm can be dismounted and replaced, so that the use is facilitated, and the efficiency is increased; by using an MEMS processing process, the size of the sensor is reduced; precipitation particles can be measured by using the micro-mechanical sensor.

Description

technical field [0001] The invention discloses a micro-mechanical sensor based on MEMS, which belongs to the technical field of micro-mechanical sensors. Background technique [0002] Measuring precipitation is an important part of meteorological measurements. Traditional methods of measuring precipitation mainly use tipping bucket or cylinder rain gauges. However, there is a wetting error in the traditional rain gauge. When there are only a few precipitation particles, the wetting error may make the instrument unable to detect the precipitation particles. At the same time, traditional rain gauges cannot measure the mass of raindrops, nor can they distinguish raindrops from hail. [0003] The current raindrop spectrometer based on the principle of optical scattering can measure the quality of raindrops and avoid infiltration errors. However, this raindrop spectrometer is expensive, difficult to use on a large scale, and its production process is not compatible with microe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01N27/14
Inventor 刘清惓李海涛朱俊丰高翔
Owner NANJING UNIV OF INFORMATION SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products