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Gold-silver-palladium alloy single-crystal bonding wire and manufacturing method thereof

A palladium alloy, bonding wire technology, applied in semiconductor/solid-state device manufacturing, circuits, electric solid-state devices, etc., can solve the problems of high production cost, drawing and disconnection, poor high temperature stability, etc., and achieve stable and reliable performance and production. High cost and low price effect

Inactive Publication Date: 2014-05-07
江西蓝微电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a gold-silver-palladium alloy single crystal bonding wire with high-purity silver as the main material and its manufacturing method, which overcomes the existing alloy bonding copper wire, the surface of aluminum wire is easy to oxidize, the high temperature stability is poor and the pull The problem of unplugging and disconnection, and the defects and deficiencies of high production cost of gold-based bonding wire, low hardness of electroplating layer and no resistance to friction

Method used

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Examples

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Comparison scheme
Effect test

Embodiment 1

[0018] The present invention is achieved in this way, a gold-silver-palladium alloy single-crystal bonding wire with high-purity silver as the main material, and the material constituting the bonding wire is composed of the following raw materials by weight: gold (Au) accounts for 0.8%, palladium ( Pd) accounts for 0.04%, europium (Eu) accounts for 0.002%, lanthanum (La) accounts for 0.001%, silver (Ag) accounts for 99.157%; the purity of gold is required to be greater than 99.99%, the purity of silver is greater than 99.9999%, and the purity of palladium is greater than 99.999 %, the purity of europium is greater than 99.9%, and the purity of lanthanum is greater than 99.5%.

[0019] The manufacturing process steps and method of the gold-silver-palladium alloy single crystal bonding wire are as follows:

[0020] ① Extracting high-purity silver: Immerse No. 1 silver (IC-Ag99.99) as the anode into the electrolyte, and use the high-purity silver foil as the cathode to immerse in...

Embodiment 2

[0031] A gold-silver-palladium alloy single-crystal bonding wire with high-purity silver as the main material, the material of the bonding wire is composed of the following raw materials by weight: gold (Au) accounts for 1.2%, palladium (Pd) accounts for 0.08%, europium (Eu) accounts for 0.004%, lanthanum (La) accounts for 0.003%, and silver (Ag) accounts for 98.713%; the purity of gold is required to be greater than 99.99%, the purity of silver is greater than 99.9999%, the purity of palladium is greater than 99.999%, and the purity of europium is greater than 99.9 %, the purity of lanthanum is greater than 99.5%.

[0032] The manufacturing process steps and method of the gold-silver-palladium alloy single crystal bonding wire are as follows:

[0033] ① Extracting high-purity silver: Immerse No. 1 silver (IC-Ag99.99) as the anode into the electrolyte, and use the high-purity silver foil as the cathode to immerse into the electrolyte; input 9V, 3.5A direct current between the ...

Embodiment 3

[0043]A gold-silver-palladium alloy single-crystal bonding wire with high-purity silver as the main material, the material forming the bonding wire is composed of the following raw materials by weight: gold (Au) accounts for 1.0%, palladium (Pd) accounts for 0.06%, europium (Eu) accounts for 0.003%, lanthanum (La) accounts for 0.002%, and silver (Ag) accounts for 98.935%. The purity of gold is required to be greater than 99.99%, the purity of silver is greater than 99.9999%, the purity of palladium is greater than 99.999%, the purity of europium is greater than 99.9%, and the purity of lanthanum is greater than 99.5%.

[0044] The manufacturing process steps and method of the gold-silver-palladium alloy single crystal bonding wire are as follows:

[0045] ① Extracting high-purity silver: Immerse No. 1 silver (IC-Ag99.99) as the anode into the electrolyte, and use the high-purity silver foil as the cathode to immerse into the electrolyte; input 8V, 3.0A direct current between t...

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Abstract

Provided are a gold-silver-palladium alloy single-crystal bonding wire and a manufacturing method thereof. The main material of the gold-silver-palladium alloy single-crystal bonding wire is high-purity silver, and the gold-silver-palladium alloy single-crystal bonding wire further comprises gold, palladium, europium, lanthanum and other trace metal materials. The gold-silver-palladium alloy single-crystal bonding wire comprises, by weight, 98.713%-99.157% of the silver, 0.8%-1.2% of the gold, 0.04%-0.08% of the palladium, 0.002%-0.004% of the europium and 0.001%-0.003% of the lanthanum. The manufacturing method comprises the steps that the high-purity silver with the purity higher than 99.9999% is extracted and manufactured into silver alloy ingots, as-cast gold-silver-palladium alloy single-crystal main wires are manufactured, the single-crystal main wires are manufactured into single-crystal wires of around 1mm through a drawing mode, heat treatment is carried out on the single-crystal wires, and then gold-silver-palladium alloy single-crystal bonding wires of different specifications are manufactured through precise drawing, heat treatment and cleaning.

Description

technical field [0001] The invention relates to a metal bonding wire and a manufacturing method thereof, in particular to a gold-silver-palladium alloy single crystal bonding wire made of gold, silver, palladium and other alloy materials and a manufacturing method thereof. Background technique [0002] At present, the most widely used wire packaging bonding wire used in the fields of integrated circuits and semiconductor discrete devices is gold bonding wire. Because yellow metal is a precious metal, the price is expensive and rising day by day, which brings heavy cost pressure to the users of low-end LED and IC packaging with the largest consumption. Therefore, the industry urgently needs new bonding wire materials with relatively low cost and stable and reliable performance to replace gold bonding wires. The gold-silver-palladium alloy single crystal bonding wire with high-purity silver as the main material has both the advantages of silver-based bonding wire and the adva...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/48C22C5/06
CPCH01L24/43H01L2224/43H01L2224/45144H01L2224/45H01L2924/00012
Inventor 徐云管李湘平彭庶瑶梁建华
Owner 江西蓝微电子科技有限公司
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