Novel method for measuring thermal resistance of power-type LED integration module
A technology of integrated modules and test methods, applied in the semiconductor and optical fields, can solve the problems of integrated module technology blank, underestimation of the actual thermal resistance value, etc., to reduce the test cost and facilitate the operation.
Inactive Publication Date: 2014-05-28
MINNAN NORMAL UNIV
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However, the above-mentioned thermal resistance methods have certain limitations. Both methods need to calibrate the temperature coefficient of voltage. Strictly speaking, the traditional electrical test method will underestimate the actual thermal resistance value because the temperature sensor is placed directly above the aluminum substrate; The characteristic test method requires complex structure function theory to calculate and obtain the thermal resistance-thermal capacity distribution information of each layer inside the device; Therefore, it creates a technical gap in the test and evaluation of thermal characteristics of integrated modules
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[0017] The present invention will be described in further detail below in conjunction with the accompanying drawings.
[0018] The power LED integrated module is placed on the radiator, figure 1 Middle Radiator HS 1 It is fin plate type, number 1 is fin plate radiator HS 1 The base plate, number 2 is the finned plate heat sink HS 1 the ribs, figure 2 Middle Radiator HS 2 It is the nail post fork row type, and No. 3 is the nail post fork row radiator HS 2 The base plate, No. 4 is the nail column fork radiator HS 2 nail post. Radiator HS 1 and HS 2 The difference is: finned plate radiator HS 1 Because the smooth fins have a "comb flow" effect, the air flow forms a thicker laminar bottom layer on the wall of the radiator fins, and its heat transfer effect is poor. In the nail column cross-row radiator, the staggered distribution of nail columns can effectively destroy the radiator HS 2 The laminar bottom layer of the base enhances the fluid turbulence, and its heat tr...
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The invention discloses a method and device for measuring thermal resistance of a power-type LED integration module by utilizing a transient thermal response curve. The method for measuring the thermal resistance of the power-type LED integration module by utilizing the transient thermal response curve is characterized in that the power-type LED integration module is arranged in two radiators with different specifications and models; a constant current power supply is utilized to drive a device to be measured; meanwhile, a high-precision voltage data acquisition instrument is utilized to measure forward voltage change curves of the device fixed to the two radiators, and a forward voltage initial value V1 and a voltage value V2 corresponding to separation inflection points are recorded; a pulse current, of which duty ratio is very low, is loaded to prevent a chip from producing self-heating; and the junction temperature of an LED is adjusted indirectly by utilizing a temperature-control cold plate, and then the thermal resistance of the power-type LED integration module is obtained by calculating and analyzing the inner link between the voltage-junction temperature-time of the device to be measured. The method can be used for measuring the thermal resistance of the power-type LED integration module accurately.
Description
technical field [0001] The invention belongs to the technical fields of semiconductor, optics and the like, and is a technology for accurately measuring the thermal resistance characteristics of a power type LED integrated module. Background technique [0002] For LED integrated modules, thermal resistance is an important parameter, and its size will directly affect its optical efficiency and reliability. How to accurately test the thermal resistance is the core issue in studying the thermal characteristics of power LED integrated modules. At present, the junction temperature of LED devices can be tested by different methods, the most widely used is the electrical test method, the NC2991 transistor thermal resistance tester developed by the research group of Professor Zhang Wansheng of the 13th Institute of China Electronics Technology Group according to the GB / T4587-94 standard , Professor Feng Shiwei of Beijing University of Technology calculated the thermal resistance ...
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IPC IPC(8): G01R31/26
Inventor 陈焕庭周小方杨伟艺罗毅
Owner MINNAN NORMAL UNIV