Apparatus and method for manufacturing electronic component

Abstract

In a state that the periphery of a rotary knife can rotate and cut in a direction being from a surface (upper surface) of a substrate as the top layer to inner side, a workbench moves in a +X direction and the rotary knife cuts the substrate. Secondly, in a state that the periphery of the rotary knife can cut in a direction being from a surface (lower surface) of a packaging resin as a lowest layer to the inner side, the workbench moves in a -X direction and the rotary knife cuts the packaging resin, and therefore a bilayer-structure resin packaged body composed of the substrate and the packaging resin is cut off. Thus, roll rims and 'burrs' which can be generated when the bilayer-structure resin packaged body is cut off once by the rotary knife are prevented.

Description

technical field [0001] The present invention relates to an electronic component manufacturing apparatus and a manufacturing method used when cutting a resin package having a substrate, a plurality of chip-shaped components, and a sealing resin to manufacture a plurality of electronic components. Background technique [0002] When manufacturing electronic components, a technique of cutting a resin package by using a rotary knife (blade) to singulate a plurality of electronic components is widely practiced (for example, refer to Patent Document 1). A resin package as an object to be cut has: a substrate having a plurality of regions; a plurality of chip-like elements mounted in a plurality of regions of the substrate; on the substrate. In this manner, the resin package is a composite material in which a substrate on which a plurality of chip-shaped components is mounted and an encapsulating resin are laminated. [0003] The substrate includes a lead frame made of copper and ...

AI Technical Summary

Problems solved by technology

The first problem is that curling (defect) occurs in the slice near the cut surface (for example, refer to paragraph [0090] of Patent Document 3)

The second problem is that "burrs" composed of the substrate (including metal foil such as copper foil provided on the substrate) and the sealing resin are generated on the end surface of the cut chip (hereinafter, the end surface is referred to as the cut surface). (For example, refer to paragraphs [0011] to [0012] of Patent Document 2, and paragraph [0012] of Patent Document 3)

[0014] However, in the first countermeasure, since the two cutting blades are driven, the cutting device becomes complicated and the drive control of the two cutting blades becomes unsatisfactory.

On the other hand, in the second countermeasure, although the cutting knife is maintained as one knife, the structure of one cutting knife (blade) becomes complicated and it is necessary to prepare multiple types corresponding to the combination of a plurality of different materials constituting the resin package. Unsatisfactory problems with blades

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