Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Offline machine utilization calculation system and calculation method

A computing system and computing method technology, applied in the direction of comprehensive factory control, electrical components, comprehensive factory control, etc., can solve the problems of inconvenient analysis and allocation of resources by engineers, inaccurate statistics of machine usage, and untimely switching of machine status, etc. , to achieve the effect of realizing automatic calculation, solving inaccuracy and reducing waste

Active Publication Date: 2016-09-07
SHANGHAI HUALI MICROELECTRONICS CORP
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, often due to the long time of measuring / sweeping goods or other objective reasons, the assistant engineer does not switch the status of the machine in time, or forgets to switch, etc., which leads to inaccurate statistics on the use of the machine, and has a negative impact on the analysis and allocation of resources by the engineer. caused great inconvenience and resulted in an extreme waste of manpower

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Offline machine utilization calculation system and calculation method
  • Offline machine utilization calculation system and calculation method
  • Offline machine utilization calculation system and calculation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be further described below in conjunction with the accompanying drawings. Of course, the present invention is not limited to this specific embodiment, and general replacements known to those skilled in the art are also covered within the protection scope of the present invention.

[0023] figure 1 It is a block diagram of an off-line machine utilization calculation system according to an embodiment of the present invention. like figure 1 As shown, the computing system includes a computer terminal file generating unit 11 , an analyzing unit 12 , a database 13 and a computing unit 14 . Wherein, the machine-side file generating unit 11 is used to generate machine-side files according to predetermined naming rules, and the analyzing unit 12 is connected with the machine-side file generating unit 11 for analyzing the file names of each machine-s...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an offline machine use ratio calculation system. The offline machine use ratio calculation system comprises a machine end file generation unit, an analysis unit, a database and a calculation unit. The machine end file generation unit is used for generating machine end files according to a preset naming rule. The analysis unit is used for analyzing the file names of machine end files so as to extract run parameter information of offline machines for processing each wafer. The database is used for storing run readiness time of each offline machine and run time functions related to run parameters of the offline machines for processing the wafers. The calculation unit is used for calculating the run time of each wafer according to the running parameter information of the offline machines for processing each wafer and the run time functions, and obtaining the total run time of the offline machines for processing all the wafers and the use ratio of the offline machines according to all the run time and all the run readiness time. The invention further provides an offline machine use ratio calculation method, and statistics can be effectively carried out on the real use condition of the offline machines.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing technology, in particular to a calculation system and a calculation method for the utilization rate of offline machines in semiconductor equipment. Background technique [0002] With the development of semiconductor manufacturing technology and the continuous improvement of process automation, the calculation of the production utilization rate of online machines such as online process machines and measuring machines is becoming more and more accurate. However, there are still certain problems in semiconductor process production plants. Type and quantity of offline machines. Commonly used offline machines include scanning electron microscope inspection machines, optical inspection machines, ion beam cutting machines, and particle inspection machines. For the calculation of the production utilization rate of the online machine, due to its online characteristics, the data of the machi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/418H01L21/67
CPCY02P90/02
Inventor 范荣伟龚丹莉刘飞珏陈宏璘龙吟
Owner SHANGHAI HUALI MICROELECTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com