MEMS Microphone Package Structure

Abstract

The invention discloses a packaging structure of a micro-electromechanical microphone, which includes a base with a surface, the base has a perforation; a micro-electromechanical microphone chip, the micro-electromechanical microphone chip has a first surface and a second surface, the first The surface is electrically connected to the surface of the base, and the MEMS microphone chip is provided with a deep hole from the second surface toward the first surface; a control chip, the control chip has a first surface and a second surface, wherein The first surface of the control chip is fixed on the second surface of the micro-electromechanical microphone chip, and the second surface of the control chip is electrically connected to the base through a plurality of wires; and a packaging material, which covers the base, the A micro-electromechanical microphone chip, the control chip and wires. The invention has the advantages of small size but no loss of performance, effectively reduces the packaging volume and reduces the manufacturing cost.

Description

technical field [0001] The present invention relates to a microelectromechanical system (hereinafter referred to as MEMS) microphone packaging structure, in particular to a stacking arrangement of a control chip and a microelectromechanical microphone chip, and a groove can be etched on the crystal back of the control chip to The deep hole etched on the back of the micro-electro-mechanical microphone chip forms an enlarged back cavity, and uses the sealant or primer to protect the solder pads in the micro-electro-mechanical microphone package structure from exposure to the micro-electro-mechanical microphone package that may cause corrosion in the atmospheric environment structure. Background technique [0002] The demand for high-quality miniature microphones has increased rapidly due to the increasing demand for mobile phones and the increasing requirements for sound quality of mobile phones, coupled with the gradual maturity of hearing aid technology. Due to the advantag...

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Problems solved by technology

[0003] Figure 5 Shown is a structural schematic diagram of an existing microelectromechanical microphone packaging structure, the microelectromechanical microphone packaging structure shown in the figure includes a base 90, a microelectromechanical microphone chip 91, a control chip 92 and a packaging cover 93, wherein the microelectromechanical The microphone chip 91 is wrapped inside the package formed by the combination of the package cover 93 and the base 90 and is controlled by the adjacent control chip 92. In this traditional process, the micro-electromechanical microphone chip 91 and the control chip 92 are separately attached to the base 90, and then Use packaging cover 93 to cover and protect, but this embodiment has three missing items: one, the micro-electromechanical microphone chip 91 is typically set adjacent to the control chip 92, and therefore must have a base 90 with a large enough area to accommodate, so It makes it difficult to reduce the overall size of the micro-electro-mechanical microphone packaging structure; secondly, because the micro-electro-mechanical microphone chip 91 and the control chip 92 are connected to the wires and soldering pads of the base 90, etc., are exposed in a chamber 94 of the micro-electro-mechanical microphone packaging structure. Moisture and dust from the outside easily enter the chamber 94 through the sound hole 95 on the base 90, thereby causing oxidation or damage to the wires 96 and welding pads 97 of the chips 91, 92, thereby reducing reliability. Gold and other precious metals must be used for welding pads 97 to avoid corrosion, which is expensive and difficult to ensure that the wires will not fall off; third, the mechanical properties of the package cover 93 and the base 90 are quite different. The reduction makes it difficult to reduce the overall package thickness, and the overall cost and reliability have room for improvement

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