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High Efficiency Finfet Diodes

A diode and finfet technology, applied in the field of high-efficiency FinFET diodes, can solve the problems of reduced diode efficiency, reduced effective area of ​​injection current, reduced diode efficiency, etc.

Active Publication Date: 2017-03-01
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, diodes constructed using FinFET structures have the disadvantage of reduced efficiency compared to conventional planar semiconductor diodes due to degradation caused by the fin structure
The presence of multiple fin structures in a FinFET diode reduces the effective area used to generate the injection current, thereby reducing the diode efficiency determined by the injection current generated per unit cell area

Method used

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  • High Efficiency Finfet Diodes
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  • High Efficiency Finfet Diodes

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Embodiment Construction

[0034] It should be understood that the invention provides many different embodiments or examples for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the following description, a first component formed over or on a second component may include an embodiment in which the first component and the second component are formed in direct contact, and may also include an embodiment in which the first component and the second component are formed in direct contact. Embodiments of other components are formed between the components, that is, embodiments in which the first component and the second component are not in direct contact. In addition, the present invention may repeat reference numerals and / or letters in various instances. This repetition is intended for brevity and clarity, and by it...

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Abstract

The present invention relates to high-efficiency FinFET diodes and methods of manufacturing the same, which are designed to address the degradation of conventional FinFET diodes caused by reduced active area. The FinFET diode has a doped substrate, two sets of separated substantially parallel equidistant semiconductor fin structures, a dielectric layer formed between the two sets of fin structures and used for insulation between the fin structures, vertically across the two sets of A plurality of substantially equidistant and parallel elongated gate structures of the fin structure, and two sets of semiconductor strips are vertically formed on the two sets of fin structures respectively. The two sets of semiconductor strips are doped to have opposite conductivity types: p-type and n-type. FinFET diodes also have metal contacts formed over the semiconductor strips. In one embodiment, the semiconductor strips may be formed integrally with the fin structure by epitaxial growth and in-situ doping.

Description

[0001] This application claims priority to US Provisional Patent Application Serial No. 61 / 747,764, filed December 31, 2012, the entire contents of which are hereby incorporated by reference. technical field [0002] The present invention relates generally to the field of semiconductors, and more particularly to high efficiency FinFET diodes. Background technique [0003] The semiconductor industry has evolved to pursue higher device density, higher performance, and lower cost nanotechnology nodes. As such advances have occurred, the challenges of fabrication and design issues have prompted the development of three-dimensional designs, such as Fin Field Effect Transistor (FinFET) devices. The use of FinFET devices has gained popularity in the semiconductor industry. FinFET devices offer several advantages over traditional metal-oxide-semiconductor field-effect transistor (MOSFET) devices, also known as planar devices. These advantages may include higher chip area efficienc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/41H01L29/861
CPCH01L29/66136H01L29/861H01L29/161H01L29/1608H01L29/201H01L27/0924H01L21/823821H01L21/326H01L23/60H01L29/78H01L29/7848H01L21/823814H01L29/165H01L21/0257H01L21/26513H01L21/823871H01L21/823878
Inventor 范学实张胜杰胡嘉欣梁铭彰吴显扬谢文兴黄靖方
Owner TAIWAN SEMICON MFG CO LTD
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