Method for machining sapphire special-shaped hole

A processing method, sapphire technology, is applied in the processing of sapphire special-shaped holes and the field of sapphire crystal hole processing, which can solve the problems of crystals (easy to crack, small processing thickness range, large equipment investment, etc.), and achieve surface precision. The effect of low cost and high drilling efficiency

Active Publication Date: 2014-07-23
TUNGHSU GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the sapphire crystal (sheet) is mainly opened by laser drilling, and its defects are as follows: firstly, the range of thickness that can be processed by laser drilling is small, and the thickness that can be processed is ≤0.60mm; on the other hand, the equipment for laser drilling is usually very expensive, which makes the equipment investment Large; and the crystal (sheet) is easy to crack during the laser drilling process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] A method for processing sapphire shaped holes, the steps of the method are as follows: first clean the surface of the sapphire workpiece blank with absolute ethanol, then clean the surface of the aluminum sheet of the backing plate with absolute ethanol, heat the aluminum sheet of the backing plate to 150 ° C, and use WX -02 type high-temperature adhesive wax to fix the sapphire workpiece blank on the backing plate aluminum sheet, heat the backing plate aluminum sheet and the sapphire workpiece blank naturally, cool to room temperature, fix the backing plate aluminum sheet on the drilling table, and Mix 240-mesh boron carbide and water at a mass ratio of 1:1.5 to form a suspension, fix the hole-drilling die on the head of the hole-drilling machine, start the circulation pump, and align the outlet of the boron carbide suspension with the hole opening , start the ultrasonic generator, adjust the ultrasonic power to 100w, frequency 30kHz, the hole opening die head automatic...

Embodiment 2

[0013] A method for processing sapphire shaped holes, the steps of the method are as follows: first clean the surface of the sapphire workpiece blank with absolute ethanol, then clean the surface of the aluminum sheet of the backing plate with absolute ethanol, heat the aluminum sheet of the backing plate to 160 ° C, and use WX -02 type high-temperature adhesive wax to fix the sapphire workpiece blank on the backing plate aluminum sheet, heat the backing plate aluminum sheet and the sapphire workpiece blank naturally, cool to room temperature, fix the backing plate aluminum sheet on the drilling table, and Mix 240-mesh boron carbide and water at a mass ratio of 1:1.5 to form a suspension, fix the hole-drilling die on the head of the hole-drilling machine, start the circulation pump, and align the outlet of the boron carbide suspension with the hole opening , start the ultrasonic generator, adjust the ultrasonic power to 150w, frequency 32kHz, the hole opening die head automatic...

Embodiment 3

[0015] A method for processing sapphire shaped holes, the steps of the method are as follows: first clean the surface of the sapphire workpiece blank with absolute ethanol, then clean the surface of the aluminum sheet of the backing plate with absolute ethanol, heat the aluminum sheet of the backing plate to 170 ° C, and use WX -02 type high-temperature adhesive wax to fix the sapphire workpiece blank on the backing plate aluminum sheet, heat the backing plate aluminum sheet and the sapphire workpiece blank naturally, cool to room temperature, fix the backing plate aluminum sheet on the drilling table, and Mix 240-mesh boron carbide and water at a mass ratio of 1:1.5 to form a suspension, fix the hole-drilling die on the head of the hole-drilling machine, start the circulation pump, and align the outlet of the boron carbide suspension with the hole opening , start the ultrasonic generator, adjust the ultrasonic power to 180w, frequency 35kHz, the hole opening die head automatic...

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Abstract

The invention discloses a method for machining a sapphire special-shaped hole. The surface of a sapphire workpiece semi-finished product is firstly washed with absolute ethyl alcohol; the surface of a base plate aluminum sheet is then washed with absolute ethyl alcohol; the base plate aluminum sheet is heated, and the base plate aluminum sheet and the sapphire workpiece semi-finished product are naturally radiated and cooled to be at the indoor temperature; the base plate aluminum sheet is fixed on a trepanning working platform; suspensions are mixed at the indoor temperature; a trepanning mold head is fixed on a trepanning machine head; a circulating pump is then started, and the trepanning process is automatically completed by the trepanning mold head under the gravity effect of the trepanning machine head; then the sapphire workpiece semi-finished product is separated from the base plate aluminum sheet, and the base plate aluminum sheet and the sapphire workpiece semi-finished product are naturally cooled to be at the indoor temperature. The method is high in trepanning efficiency, crystals are not prone to being cracked in the trepanning process, the trepanning surface accuracy is high, the trepanning process is easy to operate, and the device cost is low.

Description

technical field [0001] The invention relates to a method for processing sapphire crystal holes, in particular to a method for processing special-shaped sapphire holes, and belongs to the technical field of crystal processing. Background technique [0002] As an important technical crystal, sapphire crystal has been widely used in many fields such as science and technology, national defense, civil industry and electronic technology. Sapphire crystal is composed of three oxygen atoms and two aluminum atoms in the form of covalent bonds, and its crystal structure is a hexagonal lattice structure. The hardness of sapphire crystal is very high, with a Mohs hardness of 9, second only to the hardest diamond. It has good light transmission, thermal conductivity and electrical insulation, good mechanical and mechanical properties, and has the characteristics of wear resistance and wind erosion resistance. The melting point of sapphire crystal is 2050°C, the boiling point is 3500°C,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/00
Inventor 秦光临王禄宝
Owner TUNGHSU GRP
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