Simulation/radio frequency integrated circuit design method based on SPICE software

Abstract

The invention relates to a simulation / radio frequency integrated circuit design method based on SPICE software. The method comprises the following steps: (1) determining the demands of the circuit system characteristics on the reliability, and describing the amount of degeneration as a device characteristic function under the condition of the certain stress after some time; (2) adjusting the parameters of components, optimizing a circuit system, finding the key component with great effect on the circuit system characteristics and great effect by the stress, optimizing parameters of the key component, and lengthening the life cycle of the circuit system; (3) using the Monte Carlo simulation of the SPICE to carry out the model simulation on various technological parameters of the system; if the demands on the reliability are not accorded, returning to the step (2), and redesigning the key circuit to satisfy the demands of the system. The method greatly realizes the synchronism of the functional simulation and reliability simulation in the design stage, and the parameters affecting the life cycle are only required to be adjusted when the process is changed.

Description

technical field [0001] The invention relates to an integrated circuit design method. In particular, it relates to an analog / radio frequency integrated circuit design method based on SPICE software. Background technique [0002] With the development of integrated circuit manufacturing technology, the principle of scaling down is adopted (that is, at a constant voltage, the device size is reduced by k times, the doping concentration is increased by k times, the electric field intensity is increased by k times, and the current density is increased by k 3 Times), so that the scale of IC increases and the performance and functions continue to expand and improve. However, because the working voltage cannot be reduced accordingly, the current density and electric field strength in the circuit are greatly increased, and with the adoption of some new technologies, such as the use of multi-layer wiring technology, the interconnection line has to pass through multiple complex steps, a...

AI Technical Summary

Problems solved by technology

But these simulation tools are more focused on the accuracy and applicability of the failure model rather than the optimal design for overhead and integration

On the other hand, since people are more likely to improve reliability by improving process steps or methods in the integrated circuit manufacturing stage, there are very few simulators that can optimize design and perform reliability simulation at present.

Images