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Ceramic package

A ceramic packaging and ceramic technology, applied in printed circuits, electrical components, circuits, etc., can solve the problem of not being able to seal the cavity with a metal cover, and achieve the effect of reducing the peeling of ceramics

Inactive Publication Date: 2014-07-30
NGK SPARK PLUG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, when the metal frame is brazed along the first and second metal layers, the metal frame is inclined, so the cavity cannot be sealed with the metal cover welded on the metal frame.

Method used

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  • Ceramic package
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0053] Hereinafter, modes for implementing the present invention will be described.

[0054] figure 1 It is a plan view showing the first ceramic package 1 of the present invention, figure 2 the left side is along the figure 1 The partial enlarged cross-sectional view of the side part seen by the arrow of the X-X line in image 3 the left side is along the figure 1 Partial enlarged cross-sectional view of the corner viewed by the arrow of the Y-Y line in .

[0055] Such as Figure 1 ~ Figure 3 As shown, the first ceramic package 1 includes: a package body 2, which has a frame-shaped surface 3 when viewed from above and a rectangular (rectangular) back 4 when viewed from above, and has a cavity 6 opening on the surface 3; The first metal layer 11 and the second metal layer 12 formed on the surface 3 above.

[0056] The package main body 2 is a box-shaped body including four outer surfaces 5 and a plurality of laminated ceramic layers made of, for example, ceramic S su...

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PUM

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Abstract

Provided is a ceramic package having a cavity for mounting of an electronic component such as a crystal oscillator, whereby a metal frame can be joined evenly around the opening, and sealing of the opening performed in a reliable manner. The ceramic package (1) is provided with: a package body (2) made of a ceramic, having a front surface (3) and a back surface (4) of rectangular shape in plan view, and a cavity (6) opening onto the front surface (3); a first metallization layer (11) of frame shape in plan view formed on the front surface (3); and a second metallization layer (12) of frame shape in plan view formed on the surface (10) of the first metallization layer (11), and having width (w2) along the mediolateral direction of the package body (2) that is narrower than the width (w1) of the first metallization layer (11), wherein in the ceramic package (1), the width (w2) of the second metallization layer (12a) along the mediolateral direction at the corners (C) of the front surface (3) in plan view is narrower than the width (w1) along the mediolateral direction of the second metallization layer (12) in regions other than the corners (C) in plan view.

Description

technical field [0001] The present invention relates to a ceramic package for mounting an electronic device such as a crystal resonator, a semiconductor element, or a piezoelectric element, and having a cavity capable of reliably sealing an opening. Background technique [0002] For example, in order to seal the opening of a cavity of a ceramic package and increase the brazing strength of a metal seal ring brazed to the opening, a sealing structure of a ceramic package formed in such a manner that the outer periphery of the cavity is formed has been proposed. The first layer of metal pattern is printed in layers, and the high melting point metal is printed on the surface of the pattern and in the middle of the inner and outer directions with a constant width to form a second layer of thick film pattern for solder accumulation, along the top of the two patterns Form a thinner third-layer metal pattern with a hat-shaped section in the inner-outer direction, and braze the above...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/02H01L23/08H03H9/02
CPCH01L23/10H01L21/50H01L2224/16225H01L2224/32225H01L2224/73204H03H9/1014H05K1/0306H05K1/183H05K2201/09036H05K2201/10075H01L2924/00
Inventor 山本宏明吉田美隆东条孝俊鬼头直树秋田和重铃木淳
Owner NGK SPARK PLUG CO LTD
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