Method for obtaining residual stress of C-fiber reinforced resin matrix composite at thermocuring temperature
A fiber-reinforced resin and composite material technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve the problems of long cycle, high experiment cost, huge investment of manpower and material resources, and achieve easy operation and wide application range The effect of widening and saving working time
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specific Embodiment approach 1
[0013] Embodiment 1: A method of obtaining the residual stress of C fiber-reinforced resin-based composite material through thermal curing temperature in this embodiment is carried out according to the following steps:
[0014] 1. Input the mechanical properties and thermal expansion coefficient of the C fiber reinforced resin matrix composite material into the computer;
[0015] 2. Input the thermal curing temperature and room temperature of 100-130°C into the computer, and use the numerical simulation method to deduce the residual stress distribution of the single-layer board of C fiber reinforced resin matrix composite material, and obtain the contact relationship between the single-layer boards;
[0016] 3. Establish the numerical relationship between the contact relationship between the single-layer plates obtained in step 2 and the residual stress of the C fiber-reinforced resin-based composite material, and then calculate to obtain the residual stress of the C-fiber-rein...
specific Embodiment approach 2
[0022] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the thermal curing temperature in step 2 is 120°C. Others are the same as in the first embodiment.
[0023] Prove the beneficial effect of the present invention by following test:
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