A kind of novel conductive glue and preparation method thereof

Abstract

The invention discloses a novel conductive adhesive. The novel conductive adhesive is prepared from the following raw materials in parts by weight: 5-50 parts of modified epoxy resin, 0-20 parts of epoxy resin, 5-20 parts of curing agent, 30-70 parts of silver coated copper powder, 1-30 parts of nano-silver alloy powder, 0.1-1 part of defoaming agent, 0.1-1 part of antioxidant and 0.1-1 part of flame retardant. The preparation method comprises the following steps of weighing the raw materials according to the ratio of the formula of the conductive adhesive, mixing and stirring the raw materials uniformly, finally stirring and defoaming the raw materials by using a vacuum defoaming stirrer, thereby obtaining the conductive adhesive after stirring and defoaming. The novel conductive adhesive has the characteristics of long period of use, suitable viscosity for silk screen printing, high temperature resistance, low expansion coefficient, high conductivity and long shelf time.

Description

technical field [0001] The invention relates to a novel conductive adhesive and a preparation method thereof, in particular to a novel conductive adhesive used for connecting via holes of PCB lines and a preparation method thereof. Background technique [0002] With the rapid development of electronic technology, the miniaturization and integration of electronic products has become the development trend of today's products. In order to achieve the above purpose, the packaging of liquid crystal modules and other electronic products such as digital cameras and video cameras mainly uses conductive adhesives to bond circuit components to printed circuit boards. Conductive adhesive is a kind of alloy adhesive with screen printing performance and certain conductivity through baking and curing. It is composed of matrix resin, conductive filler and related additives; conductive adhesive can be divided into structural type and filling type according to the composition of the matrix. ...

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Problems solved by technology

[0003] At present, since the conductive adhesives in the prior art are all of a single filling type, the high temperature resistance performance of the high-order board is insufficient, and the expansion coefficient is too large, which also greatly reduces the reliability. Therefore, a single-pack Partial, solvent-free, viscosity suitable for silk screen printing, high temperature resistance, low expansion coefficient, high conductivity conductive adhesive has become a current technical problem

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